Manufacturing Bits: June 2

By Mark LaPedus - 02 Jun, 2020 - Comments: 0

EUV lithography in outer space The U.S. space program made history on May 31, 2020, when NASA astronauts Robert Behnken and Douglas Hurley aboard SpaceX’s Crew Dragon spacecraft arrived at the International Space Station (ISS). This is the first time a commercial spacecraft has delivered astronauts to the ISS. The ISS serves as a research lab for companies, government agencies and universiti... » read more

Power/Performance Bits: June 2

By Jesse Allen - 02 Jun, 2020 - Comments: 0

Neuromorphic memristor Researchers at the University of Massachusetts Amherst used protein nanowires to create neuromorphic memristors capable of running at extremely low voltage. A challenge to neuromorphic computing is mimicking the low voltage at which the brain operates: it sends signals between neurons at around 80 millivolts. Jun Yao, an electrical and computer engineering researcher at ... » read more

(Artificially) Intelligent Verification

By Brian Bailey - 01 Jun, 2020 - Comments: 1

Functional verification produces a lot of data, , but does that make it suitable for Artificial Intelligence (AI) or Machine Learning (ML)? Experts weigh in about where and how AI can help and what the industry could do to improve the benefits. "It's not necessarily the quantity," says Harry Foster, chief scientist for verification at Mentor, a Siemens Business. "It's the quality that matter... » read more

Introducing Nanosheets Into Complementary-Field Effect Transistors (CFETs)

By Benjamin Vincent - 01 Jun, 2020 - Comments: 0

In our November 2019 blog [1], we discussed using virtual fabrication (SEMulator3D) to benchmark different process integration options for Complementary-FET (CFET) fabrication. CFET is a CMOS architecture that was proposed by imec in 2018 [2]. This architecture contains p- and n-MOSFET structures built on top of each other, instead of having them located side-by-side. In our previous blog, we r... » read more

A Benchmark Study Of Complementary-Field Effect Transistor (CFET) Process Integration Options Done By Virtual Fabrication

By Coventor - 01 Jun, 2020 - Comments: 0

Four process flow options for Complementary-Field Effect Transistors (C-FET), using different designs and starting substrates (Si bulk, Silicon-On-Insulator, or Double-SOI), were compared to assess the probability of process variation failures. The study was performed using virtual fabrication techniques without requiring fabrication of any actual test wafers. In the study, Nanosheet-on-Nanoshe... » read more

The Need for Speed

By Subodh Kulkarni - 01 Jun, 2020 - Comments: 0

We’ve previously identified the convergence occurring between surface mount technologies (SMT), used to connect packaged semiconductor devices on printed circuit boards, and advanced packaging (AP) technologies, in which connections between the semiconductor devices and to the outside world are incorporated in the packaging process using front-end-like, wafer-or panel-based manufacturing proc... » read more

An Eye For An AI

By Ed Sperling - 01 Jun, 2020 - Comments: 0

AI comes in multiple forms and flavors. The challenge is choosing the right one for the right purpose, and recognizing that just because AI can be applied to a particular process or problem doesn't mean it should be. While AI has been billed as a ideal solution for just about every problem, there are three primary requirements for a successful application. First, there needs to be sufficient q... » read more

A Different View On Debugging

By Hagai Arbel - 01 Jun, 2020 - Comments: 0

The classic approach to improve an engineering task that is becoming too complex due to its size and detail is to raise the abstraction of design representation. In this way we plan cities, build aircraft and plan 500M gate SoCs. For example, there is no way an ASIC design could go beyond a few thousand logic gates without shifting abstraction to the Register Transfer Level (RTL) and leveragin... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 29 May, 2020 - Comments: 0

Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

Week In Review: Design, Low Power

By Jesse Allen - 29 May, 2020 - Comments: 0

Tools & IP Arm unveiled several new processor IPs. Targeting next-gen smartphones, the Cortex-A78 CPU provides a 20% increase in sustained performance over Cortex-A77-based devices within a 1-watt power budget, and more efficient management of compute workloads and on-device ML. The Mali-G78 GPU provides a 25% increase in performance over the Malti-G77. It supports up to 24 cores and in... » read more

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