Lithography Options For Next-Gen Devices
By Mark LaPedus - 18 Apr, 2019 - Comments: 2

Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

ALD Tungsten Solves Capacity Challenges in 3D NAND Device Manufacturing
By Lam Research - 18 Apr, 2019 - Comments: 0

Our increasingly connected and ever “smarter” world generates increasing amounts of data, putting pressure on manufacturers who face new technical challenges in delivering the increasing capacity required for processing and storage. The ALD Tungsten process is helping 3D NAND manufacturers overcome the technical challenges of producing memory chips with higher storage capacity. 3D NAND a... » read more

Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
By Coventor - 18 Apr, 2019 - Comments: 0

In 5nm FinFET technology and beyond, SRAM cell size reduction to 6 tracks is required with a fin pitch of 24nm. Fin depopulation is mandatory to enable area scaling, but it becomes challenging at small pitches. In the first part of our study, we simulate a FinFET process flow with various fin cut approaches to obtain a 3D model of a FinFET SRAM device. Layout dependent effects on silicon and pr... » read more

Inspecting IC Packages Using Die Sorters
By Mark LaPedus - 18 Apr, 2019 - Comments: 0

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attenti... » read more

Lithography Challenges For Leading Edge 3D Packaging Applications
By Veeco - 18 Apr, 2019 - Comments: 0

Leading edge consumer electronic products drive demand for enhanced performance and small form factors. This in turn drives manufacturing requirements for all aspects of semiconductor device fabrication. As the cost of front end device manufacturing continues to escalate rapidly with each new technology node, semiconductor manufacturing companies are now also focusing on packaging technology to... » read more

From Sand To Wafers
By Steve Proia - 18 Apr, 2019 - Comments: 1

More than most industries, ours is identified with a single element, silicon. Consider the self-adopted naming conventions of all the places that want to be recognized as members of the club—Silicon Valley, Silicon Beach, Silicon Forest and so on. Silicon wafers are fundamental in manufacturing the electronic “chips” that pervade almost every aspect of our lives. New applications in IoT, ... » read more

Leveraging The Digital Twin In Smart Microelectronics Manufacturing
By Applied Materials - 18 Apr, 2019 - Comments: 0

Among the many tenets of smart manufacturing, “digital twin” solutions represent a significant opportunity for microelectronics manufacturers to leverage existing and emerging technologies to improve quality and throughput, and reduce variability and cost. The microelectronics industry is working vigorously to leverage the big data revolution and tap into smart manufacturing (SM) and Indu... » read more

Moore’s Law Now Requires Advanced Packaging
By Ed Sperling - 18 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Finding The Bottom Of The Memory Trough
By Sungho Yoon - 18 Apr, 2019 - Comments: 0

In announcing its Q2 fiscal 2019 results, Micron Technology, Inc. provided lower-than-expected revenue guidance of between $46 billion and $50 billion for the current quarter. However, what was particularly noteworthy was the company’s announcement to cut output by 5 percent due to weaker-than-expected market demand and its prediction that its customers’ inventory correction will last until... » read more

Designing For The Edge
By Ann Mutschler - 17 Apr, 2019 - Comments: 0

Chip and system architectures are beginning to change as the tech industry comes to grips with the need to process more data locally for latency, safety, and privacy/security reasons. The emergence of the intelligent edge is an effort to take raw data from endpoints, extract the data that requires immediate action, and forward other data to various local, regional or commercial clouds. The b... » read more

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