Yield And Reliability Challenges At 7nm And Below
By PDF Solutions - 26 May, 2020 - Comments: 0

Layout Design Rules have been scaled very aggressively to enable the 7nm technology node without EUV. As a result, achieving acceptable performance and yield in High Volume Manufacturing (HVM) has become an extremely challenging task. Systematic yield and parametric variabilities have become quite significant. Moreover, due to overlay tolerance requirements and diminishing process windows, reli... » read more

Latest IC Outlook: More Uncertainty
By Mark LaPedus - 26 May, 2020 - Comments: 0

So far in 2020, it’s been a difficult period in the semiconductor industry amid the Covid-19 pandemic outbreak and other issues. And heading into the second half of 2020, the industry faces more challenges, if not uncertainty, in the market. Many segments in the semiconductor industry face some headwinds, but there might be some positive news in the equipment business. To be sure,... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 May, 2020 - Comments: 0

Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 May, 2020 - Comments: 0

Tools & IP Cadence unveiled ten two verification IP (VIP) to support hyperscale data centers, automotive, and consumer and mobile applications. The new VIPs include complete bus functional models, integrated protocol checks and coverage models, and a specification-compliant verification plan. The VIPs cover CXL, HBM3, Ethernet 802.3ck, CSI-2 3.0, MIPI I3C 1.1, TileLink, eUSB2, UFS 3.1, MIP... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 22 May, 2020 - Comments: 0

Edge, cloud, data center Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies. Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 a... » read more

Introducing The Simulation World Virtual Conference For Multiphysics Verification
By Marc Swinnen - 22 May, 2020 - Comments: 0

The elimination of all live seminars and conferences has been felt particularly acutely by Ansys. The company’s extraordinary breadth of simulation products across many different physics – including fluidics, mechanical, optical, electrical, materials, and semiconductors – means that dozens of events for many different industrial sectors have been cancelled or postponed this year. In r... » read more

The Chemistry Of Semiconductors
By Ed Sperling - 21 May, 2020 - Comments: 0

At each new process node, the chemistry of chip manufacturing has become much more complex than at previous nodes. But at 5nm and below, it's going to get orders of magnitude more complex. For the first few decades, the chemistry of chips was largely shielded from view for most of the industry. Caustic gases were relatively well understood because they are a potential health hazard, but the ... » read more

EUV’s Uncertain Future At 3nm And Below
By Mark LaPedus - 21 May, 2020 - Comments: 5

Several foundries have moved extreme ultraviolet (EUV) lithography into production at both 7nm and 5nm, but now the industry is preparing for the next phase of the technology at 3nm and beyond. In R&D, the industry is developing new EUV scanners, masks and resists for the next nodes. 3nm is slated for 2022, followed by 2nm a year or two later. Nonetheless, it will require massive funding... » read more

Challenges In Stacking, Shrinking And Inspecting Next-Gen Chips
By Ed Sperling and Mark LaPedus - 21 May, 2020 - Comments: 0

Rick Gottscho, CTO of Lam Research, sat down with Semiconductor Engineering to discuss memory and equipment scaling, new market demands, and changes in manufacturing being driven by cost, new technologies, and the application of machine learning. What follows are excerpts of that conversation. SE: We have a lot of different memory technologies coming to market. What's the impact of that? ... » read more

High-Performance 300 kW 3-Phase SiC Inverter Based On Next Generation Modular SiC Power Modules
By Wolfspeed, a Cree Company - 21 May, 2020 - Comments: 0

Wolfspeed presents a new high-performance, low-cost, compact 3-phase inverter based on next generation power modules which are specifically optimized to fully utilize Wolfspeed’s third generation of silicon carbide (SiC) MOSFETs. The inverter was designed with a holistic approach with careful consideration of module specifications, busbar technology, DC link capacitors, and a high-performance... » read more

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