How to Manage One Trillion Devices on the Edge
By Arm - 11 Dec, 2019 - Comments: 0

THE EDGE, THE DATACENTER, AND NEW DESIGN PRINCIPLES: The world of compute is changing rapidly, as is the traditional view of a physical building, or buildings filled with servers, storage, and networking to “run the business”. Cloud computing, distributed cloud computing, and edge computing will all be fed by a 5G access network, forcing IT organizations to think and plan differently. Th... » read more

A UFS Verification Closure Flow Using The Synopsys Verification Continuum Platform
By Synopsys - 11 Dec, 2019 - Comments: 0

It's a longstanding cliche, but it is true that “there is no silver bullet for functional verification.” No single tool or methodology can find and shoot down all the bugs in a large, complex semiconductor design. Simulation is well understood but can be slow for today's large SoCs. Emulation hardware is fast, but expensive enough that it is usually shared across a verification team. Formal... » read more

Blog Review: Dec. 11
By Jesse Allen - 11 Dec, 2019 - Comments: 0

Arm's Urmish Thakker investigates ways to make recurrent neural networks run on resource constrained devices with limited cache and compute resources by reducing the number of RNN computations, without the need to retrain the original RNN model. Mentor's Brent Klingforth digs into the challenges of designing rigid-flex PCBs and how advanced capabilities in modern tools, like awareness of sta... » read more

Three Levers for Accelerating Lightweighting in Aerospace: Advanced Materials, Additive Manufacturing, Materials Intelligence
By Ansys - 11 Dec, 2019 - Comments: 0

Accelerating the delivery of lighter weight aircraft is possible by focusing on three key levers: more extensive use of advanced materials, broader adoption of new manufacturing techniques and extraction of more value from existing materials data. This white paper delves into the opportunities and challenges presented by each, and provides best practices for reducing fuel costs and emissions th... » read more

MLPerf Benchmarks
By Ed Sperling - 11 Dec, 2019 - Comments: 2

Geoff Tate, CEO of Flex Logix, talks about the new MLPerf benchmark, what’s missing from the benchmark, and which ones are relevant to edge inferencing. » read more

5 Major Shifts In Automotive
By Ed Sperling - 11 Dec, 2019 - Comments: 1

Much of the automotive industry has begun repositioning and retrenching over the past few months, pushing back the projected rollout for fully autonomous vehicles and changing direction on power sources and technology used in the next-generation of electric vehicles. Taken together, these shifts mark a significant departure for traditional automakers, which find themselves playing catch-up t... » read more

Reliability At 5nm And Below
By Ed Sperling - 10 Dec, 2019 - Comments: 2

The best way to figure out how a chip or package will age is to bake it in an oven, heat it in a pressure cooker, and stick it in a freezer. Those are all standard methods to accelerate physical effects and the effects of aging, but it's not clear they will continue working as chips shrink to 5nm and 3nm, or as they are included in multi-die packages. Extending any of those kitchen-like appr... » read more

The Growing Challenges Of 5G Reliability
By SE Staff - 10 Dec, 2019 - Comments: 0

The test field is getting more complicated as chips become larger, more heterogeneous, and subject to almost constant changes. Nowhere is this more evident than in 5G, where standards are still evolving and use cases are still being defined. Without passing test, no technology advances. But those definitions are subject to change, and they can change again over time. The communications in... » read more

Gaps Emerge In Test And Analytics
By Ed Sperling - 10 Dec, 2019 - Comments: 0

Sensor and process drift, increased design complexity, and continued optimization of circuitry throughout its lifetime are driving test and analytics in new directions, requiring a series of base comparisons against which equipment and processes can be measured. In the design world this type of platform is called a digital twin, but in the test world there is no equivalent today. And as more... » read more

Squeezing Out More Test Compression
By Jeff Mayer - 10 Dec, 2019 - Comments: 0

The trend in semiconductors leads to more IC test data volume, longer test times, and higher test costs. Embedded deterministic test (EDT) has continued to deliver more compression, which has been quite effective at containing test costs. For many designs, standard test compressions is enough, but ICs for use in automotive and medical devices require a higher manufacturing test quality, which t... » read more

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