category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
By Coventor - 18 Apr, 2019 - Comments: 0

In 5nm FinFET technology and beyond, SRAM cell size reduction to 6 tracks is required with a fin pitch of 24nm. Fin depopulation is mandatory to enable area scaling, but it becomes challenging at small pitches. In the first part of our study, we simulate a FinFET process flow with various fin cut approaches to obtain a 3D model of a FinFET SRAM device. Layout dependent effects on silicon and pr... » read more

Inspecting IC Packages Using Die Sorters
By Mark LaPedus - 18 Apr, 2019 - Comments: 0

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attenti... » read more

Lithography Challenges For Leading Edge 3D Packaging Applications
By Veeco - 18 Apr, 2019 - Comments: 0

Leading edge consumer electronic products drive demand for enhanced performance and small form factors. This in turn drives manufacturing requirements for all aspects of semiconductor device fabrication. As the cost of front end device manufacturing continues to escalate rapidly with each new technology node, semiconductor manufacturing companies are now also focusing on packaging technology to... » read more

From Sand To Wafers
By Steve Proia - 18 Apr, 2019 - Comments: 1

More than most industries, ours is identified with a single element, silicon. Consider the self-adopted naming conventions of all the places that want to be recognized as members of the club—Silicon Valley, Silicon Beach, Silicon Forest and so on. Silicon wafers are fundamental in manufacturing the electronic “chips” that pervade almost every aspect of our lives. New applications in IoT, ... » read more

Leveraging The Digital Twin In Smart Microelectronics Manufacturing
By Applied Materials - 18 Apr, 2019 - Comments: 0

Among the many tenets of smart manufacturing, “digital twin” solutions represent a significant opportunity for microelectronics manufacturers to leverage existing and emerging technologies to improve quality and throughput, and reduce variability and cost. The microelectronics industry is working vigorously to leverage the big data revolution and tap into smart manufacturing (SM) and Indu... » read more

Moore’s Law Now Requires Advanced Packaging
By Ed Sperling - 18 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Finding The Bottom Of The Memory Trough
By Sungho Yoon - 18 Apr, 2019 - Comments: 0

In announcing its Q2 fiscal 2019 results, Micron Technology, Inc. provided lower-than-expected revenue guidance of between $46 billion and $50 billion for the current quarter. However, what was particularly noteworthy was the company’s announcement to cut output by 5 percent due to weaker-than-expected market demand and its prediction that its customers’ inventory correction will last until... » read more

Manufacturing Bits: April 16
By Mark LaPedus - 16 Apr, 2019 - Comments: 0

Water that won’t freeze ETH Zurich and the University of Zurich have developed water that doesn’t freeze at cold temperatures. Using various molecules with water, researchers have been able to cool the substance down to minus 263 degrees Celsius. Even then, there were no ice crystals formed in the substance. This technology could be used to develop new biomolecules and membranes for ... » read more

Finding The Source Of EUV Stochastic Effects
By Katherine Derbyshire - 15 Apr, 2019 - Comments: 7

The next phase of EUV development has begun—making EUV more predictable and potentially more mainstream—and it's looking to be every bit as difficult and ambitious as other developments in advanced lithography. In the early days of EUV development, supporters of the technology argued that it was “still based on photons,” as opposed to alternatives like electron beam lithography. Whil... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Apr, 2019 - Comments: 0

Fab tools ASML said it has disagreed with any implication that it has been a victim of “Chinese espionage,” as stated in an article in a Dutch newspaper. The article discusses the results of a public court case in the United States that ASML won last year. In the case, XTAL was found by a jury to have misappropriated ASML’s confidential and proprietary information as well as trade secret... » read more

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