category: News

category: Auto, Security & Edge AI

Power/Performance Bits: Sept. 9
By Ann Mutschler - 09 Sep, 2014 - Comments: 0

Harvesting power from air A centuries-old clock built for a king is the inspiration for a group of University of Washington computer scientists and electrical engineers who hope to harvest power from the air. The clock, powered by changes in temperature and atmospheric pressure, was invented in the early 17th century by a Dutch builder. Three centuries later, Swiss engineer Jean Leon Reutter b... » read more

System Bits: Sept. 9
By Ann Mutschler - 09 Sep, 2014 - Comments: 0

First transistor-based flexible device with graphene A flexible display incorporating graphene in its pixels’ electronics has been successfully demonstrated by the Cambridge Graphene Centre and Plastic Logic, the first time graphene has been used in a transistor-based flexible device. The prototype is meant to be a first step towards the wider implementation of graphene and graphene-like ... » read more

The Week In Review: Design
By Ed Sperling - 05 Sep, 2014 - Comments: 0

Tools Mentor Graphics unveiled a hypervisor with configuration, debugging and hardware support. The solution is aimed at a variety of vertical markets, ranging from industrial and medical to consumer electronics. NXP uncorked a passive Inter-Integrated Circuit (I²C) solution for near-field communications tagging, allowing appliances, wearables and consumer electronics to use existing NFC-... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Sep, 2014 - Comments: 0

Tesla Motors plans to build a new 35-GWh, lithium-ion cell production facility for its electric vehicles. It sounds like a good idea. But the factory will bring about only a modest reduction in battery costs, and could create significant overcapacity in the arena, according to Lux Research. “The Gigafactory will only reduce the Tesla Model 3’s cost by $2,800, not enough to sway the success ... » read more

Blog Review: Sept. 3
By Ed Sperling - 03 Sep, 2014 - Comments: 0

Ansys’ Bill Vandermark flags the top five engineering technology articles of the week. A couple of these are unusual, such as e-mailing brain waves, and hoverbikes, which could really improve bike safety—as long as you don’t hit a bird. Synopsys’ Marc Greenberg looks at just how fast DDR4 can run. But what do you call it when you overclock everything? Is that still DDR4? Cadence�... » read more

Manufacturing Bits: Sept. 2
By Mark LaPedus - 02 Sep, 2014 - Comments: 0

Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more

System Bits: Sept. 2
By Ann Mutschler - 02 Sep, 2014 - Comments: 0

Thinnest semiconductor A team of researchers from the University of Washington, the University of Hong Kong and the University of Warwick have demonstrated that two single-layer semiconductor materials can be connected in an atomically seamless fashion known as a heterojunction, which they expect could be the basis for next-generation flexible and transparent computing, better light-emitting d... » read more

Power/Performance Bits: Sept. 2
By Ann Mutschler - 02 Sep, 2014 - Comments: 0

Hidden patterns Since patterned surfaces are popular among researchers seeking to induce surfaces to repel water or adhere to other things, or to modify materials’ electrical properties, materials scientists at MIT have added a new wrinkle to research on the patterning of surfaces. Most research has focused on patterns on the outer surfaces of materials, but a team in MIT’s Department of ... » read more

The Week In Review: Design
By Ann Mutschler - 29 Aug, 2014 - Comments: 0

Partnerships With an aim to drive adoption of software testing in Japan, Coverity, a Synopsys company said it has tapped OGIS-RI, a Japan-based distributor of IT solutions to partner with Coverity's software testing platform and OGIS-RI's open source license and vulnerability management tool. Maxscend Technologies has joined CEVA’s CEVAnet partner program and will offer complete solutio... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Aug, 2014 - Comments: 0

Intel announced two new technologies for foundry customers. One technology, dubbed Embedded Multi-die Interconnect Bridge (EMIB), is available to 14nm foundry customers. Instead of an expensive silicon interposer with TSVs, a small silicon bridge chip is embedded in the package, enabling high density die-to-die connections only where needed. EMIB eliminates the need for TSVs and specialized int... » read more

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