category: System-Level Design

category: IoT, Security & Automotive

Why RISC-V Is Succeeding
By Brian Bailey - 24 Feb, 2022 - Comments: 5

There is no disputing the excitement surround the introduction of the RISC-V processor architecture. Yet while many have called it a harbinger of a much broader open-source hardware movement, the reasons behind its success are not obvious, and the implications for an expansion of more open-source cores is far from certain. “The adoption of RISC-V as the preferred architecture for many sili... » read more

Unintended Coupling Issues Grow
By Brian Bailey - 24 Feb, 2022 - Comments: 0

The number of indirect and often unexpected ways in which one design element may be affected by another is growing, making it more difficult to ensure a chip — or multiple chips in a package — will perform reliably. Long gone are the days when the only way that one part of a circuit could influence another was by an intended wire connecting them. As geometries get smaller, frequencies go... » read more

Does EDA Sell Fear?
By Brian Bailey - 24 Feb, 2022 - Comments: 3

I worked in the EDA industry for over 30 years and a common lament I heard was that the EDA industry survived by selling fear. Your new chip will fail if you do not buy the latest tool offering. There always seemed to be a natural dislike for the EDA industry and many users thought the industry overcharged and was unable to innovate. I never quite understood the reasoning. A recent comment, ... » read more

Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design
By Tarek Ramadan - 24 Feb, 2022 - Comments: 0

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on top of a substrate (organic or silicon). Besides multiple dies, multiple substrates can typically exist in a 3D-IC assembly. In this case, the benefits of advanced packaging are taken to a whole ne... » read more

Are Sustainability And Safety Gen Z’s Top Requirements In 2031?
By Frank Schirrmeister - 24 Feb, 2022 - Comments: 0

This blog is my 125th on the "Frankly Speaking" channel on SemiEngineering. A big thanks to Ed and his team for a great run and for putting up with my musings! I had started work-related blogging back in 2008, more company-specific, and some of these have since then vanished from the internet. Who would have thought! For this anniversary, I am looking forward ten years to 2031 and how generatio... » read more

Intelligent Waveform Replay For Efficient Debug
By Taruna Reddy - 24 Feb, 2022 - Comments: 0

There is no doubt that design reuse is essential for today’s massive system on chip (SoC) projects. No team, no matter how large or how talented, can design billions of gates from scratch for each new chip. From the earliest days, development teams have leveraged existing gate level designs and register transfer level (RTL) code whenever possible. The emergence of the commercial intellectual ... » read more

How To Extend The ‘Unscalable’ RISC Architectures
By Rupert Baines - 24 Feb, 2022 - Comments: 0

A couple of years ago, Erik McClure (a Microsoft software developer, at the time) published a blog entitled RISC Is Fundamentally Unscalable.  This blog was really quite interesting and made some very good points about the limitations of a pure RISC design. The limitations of a pure RISC design It takes me back: some of my first marketing tasks were around the religious war between RISC ... » read more

Addressing Library Characterization And Verification Challenges Using ML
By Siemens EDA - 23 Feb, 2022 - Comments: 0

At advanced process nodes, Liberty or library (.lib) requirements are more demanding due to design complexities, increased number of corners required for timing signoff, and the need for statistical variation modeling. This results in an increase in size, complexity, and the number of .lib characterizations. Validation and verification of these complex and large .lib files is a challenging task... » read more

Achieving C-V2X Compliance
By Keysight - 23 Feb, 2022 - Comments: 0

Testing the performance of cellular vehicle-to-everything (C-V2X) components and subsystems to achieve compliance against evolving 5G test requirements is an ongoing challenge for the connected vehicle market. The global acceptance for the C-V2X technology takes autonomous driving from a shared vision to mass-market reality. C-V2X uses the 3rd Partner Project (3GPP) standard for 4G and 5G mo... » read more

Fuzz Testing Software-Defined Vehicles Using Agent Instrumentation
By Synopsys - 23 Feb, 2022 - Comments: 0

Cybersecurity has become intertwined into each step of the automotive development process. In particular, fuzz testing has proven to be a powerful approach to detect unknown vulnerabilities in automotive systems. But with limited instrumentation, especially on software-heavy systems such as high-performance computers (HPCs), several types of issues go undetected, including memory leaks and case... » read more

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