6 Oscilloscope Tricks To Get The Most Out Of Your Scope


Get the most out of your oscilloscope with these six tips covering basic triggering, probing, scaling signals, using the right acquisition mode, and more. Click here to read more. » read more

Blog Review: Nov. 23


Siemens EDA's Harry Foster looks at multiple data points to get a sense of effort spent in FPGA verification and increasing demand for FPGA verification engineers. Synopsys' Rimpy Chugh, Himanshu Kathuria, and Rohit Kumar Ohlayan argue that the quality of the design and testbench code is critical to a project’s success and that linting offers a comprehensive checking process for teams to s... » read more

Tempus Timing Signoff Solution


The Cadence Tempus Timing Signoff Solution is the fastest static timing analysis (STA) tool in the industry today with unique distributed processing and cloud capabilities enabling hundreds of CPUs to quickly complete even the largest designs. With full foundry certification and a comprehensive set of advanced capabilities, the Tempus solution delivers SPICE-accurate results to hundreds... » read more

Overview Of TVOC And Indoor Air Quality


The aim of this white paper is to cover the basics of total volatile organic compounds (TVOC) and indoor air quality (IAQ). Volatile organic compounds are the main source for poor indoor air quality, which can affect a person’s daily life. Recommendations from various institutions and agencies regarding TVOC levels that are deemed hazardous to human health are given in the “Hazardous Condit... » read more

The Politics Of Standards


Standards often are seen as an industry coming together to agree upon a common solution to a common problem, but there are times when this could not be further from the truth. Having been involved in standards at all levels — from participant to chair for several standards — some were successful, some were not, some are seeing significant adoption while others are withering by the wayside, ... » read more

Is UCIe Really Universal?


Chiplets are rapidly becoming the means to overcome the slowing of Moore's Law, but whether one interface is capable of joining them all together isn't clear yet. The Universal Chiplet Interconnect Express (UCIe) believes it will work, but some in the industry remain unconvinced. At least part of the problem is that interconnect standards are never truly finished. Even today, the protocols tha... » read more

Mastering FOWLP And 2.5D Design Is Easier Than You Think


IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by providing a platform for heterogeneous design assembly. Where designs implemented in an SoC can become too large to yield satisfactorily and too difficult to implement on one process node, pa... » read more

Addressing Three Big Challenges In Silicon Realization


There is no better way to gain insight into prevailing technical challenges than bringing together industry experts to share experiences and proposed solutions. Silicon realization—the ability to design and build today’s complex semiconductors—is one domain with no shortage of challenges. The quest for the best power, performance, and area, and delivery of first-time-right silicon, requir... » read more

EDA Tools For Quantum Chips


Commercially viable quantum computers are at least several years away, but some researchers already are questioning whether existing EDA tools will be sufficient for designing quantum chips and systems. That’s because quantum design requirements at times transcend classical rules about materials, temperature, and structure — rules that are foundational for the majority of EDA products on th... » read more

Effective Measurement Is The Key To Meeting Environmental Sustainability Goals In Data Centers


Hyperscale compute, using high-performance connected processors, continually transforms our lives as more and more applications rely on this type of compute, and at the heart of this hyperscale revolution are data centers. It is estimated that an equal amount of power is required for the airflow and cooling systems as for IT equipment. The pressure is on for organizations to create and adopt l... » read more

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