category: Top Stories

category: Auto, Security & Edge AI

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Executive Insight: Simon Segars
By Ed Sperling - 08 Jun, 2016 - Comments: 1

Simon Segars, CEO of ARM, examines the future of mobile computing, how it intersects with the IoT, why ecosystems are vital, and how computing is evolving. What follows are excerpts of that conversation. SE: Most analysts say the growth rate of mobile is slowing. The big buzz phrase now is Internet of Things. How does ARM's role change with that shift? Segars: Mobile is still changing and... » read more

Electromigration: Not Just Copper Anymore
By Katherine Derbyshire - 31 May, 2016 - Comments: 2

While integrated circuit manufacturers have worried about electromigration for a long time, until recently most of their concerns have focused on the on-chip interconnects. The larger dimensions found in integrated circuit packages have, in most cases, improved heat dissipation, reduced current density, and eliminated most [getkc id="160" kc_name="electromigration"] risks. Over the last sev... » read more

Bridging the IP Divide
By Brian Bailey - 18 May, 2016 - Comments: 1

IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that there is an implicit fuzzy contract describing how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to... » read more

The Evolving Thermal Landscape
By Ann Mutschler - 16 May, 2016 - Comments: 0

Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it's important to ensure that temperatures don't rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency. The most common approach to dealing with these issues is thermal simulation, which requir... » read more

Power-Centric Chip Architectures
By Ed Sperling - 12 May, 2016 - Comments: 0

As traditional scaling runs out of steam, new chip architectures are emerging with power as the starting point. While this trend has been unfolding for some time, it is getting an extra boost and sense of urgency as design teams weigh a growing number of design challenges and options across a variety of new markets. Among the options are [getkc id="196" kc_name="multi-patterning"] and [getkc... » read more

IP Business Models In Flux
By Ann Mutschler - 12 May, 2016 - Comments: 0

EDA and IP suppliers are engaging with foundries earlier with each manufacturing process node, while those foundries are providing ever more optimized and tuned processes to their customers. As part of this, IP providers must port their IP offerings to the various foundries and processes, putting a squeeze on resources. That raises some difficult questions, such as how to prioritize their li... » read more

Keeping The Whole Package Cool
By Katherine Derbyshire - 12 May, 2016 - Comments: 0

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

FinFET Scaling Reaches Thermal Limit
By Brian Bailey - 12 May, 2016 - Comments: 2

In 1974, Robert H. Dennard was working as an IBM researcher. He introduced the idea that MOSFETs would continue to work as voltage-controlled switches in conjunction with shrinking features, providing doping levels, the chip's geometry, and voltages are scaled along with those size reductions. This became known as Dennard's Law even though, just like Moore's Law, it was anything but a law. T... » read more

2.5D Becomes A Reality
By Ed Sperling - 11 May, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy