More Choices, Less Certainty


The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

Making IP Secure


[getkc id="43" comment="IP"] security is coming under increasing scrutiny as concerns about system and hardware security escalate. For IP, this is particularly critical because commercially available IP touches many players in the semiconductor and software ecosystem. IP users want to ensure they are using the IP as the provider intended and that they are protected against malicious code. IP... » read more

HW Vs. SW: Who’s Leading Whom?


In the past, technologies were developed in the software world that have languished until they were taken up by the hardware community. Then they were refined and polished and became fully integrated into the hardware development and verification flow. Examples are lint and formal. That was followed by attempts to migrate methodologies, such as object-oriented programming, which is the basis fo... » read more

Hybrid Emulation Gets More Hybrid


Rising chip complexity is creating a booming emulation business, as chipmakers working at advanced nodes turn to bigger iron to get chips out the door on time. What started as a "shift lift"—doing more things earlier in the design cycle—is evolving into a more complex mix of hardware-accelerated verification for both hardware and software. There are even some new forays into power explor... » read more

Culture Clash In Analog


The analog/mixed signal world is being shaken up by a mix of new tools, an influx of younger engineers with new and broader approaches, and an emphasis on changing methodologies to improve time to market. Analog and digital engineers have never quite seen eye-to-eye. Analog teams leverage techniques that have been around, in some cases, for decades, while digital teams rely heavily on the la... » read more

The New Face Of Formal


Semiconductor Engineering sat down to discuss the recent growth in adoption of formal technologies and tools with Lawrence Loh, product engineering group director at [getentity id="22032" e_name="Cadence"], Praveen Tiwari, senior manager of R&D in the verification group at [getentity id="22035" e_name="Synopsys"], Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphic... » read more

Executive Insight: Lip-Bu Tan


Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to talk about consolidation, Moore's Law, and where the opportunities are in the IoT and automotive markets. What follows are excerpts of that conversation. SE: What are the big concerns for the semiconductor industry in general, and EDA in particular? Tan: Top on my list is all the consolidation that's goin... » read more

Is The 2.5D Supply Chain Ready?


A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Is HW Or SW Running the Show?


In the past, hardware was designed and then passed over to the software team for them to add their contribution to the product. This worked when the amount of software content was small and the practice did not significantly contribute to product delays. Over time, the software content grew and today it is generally accepted that software accounts for more product expense than hardware, takes l... » read more

Can IP Integration Be Automated?


What exactly does it mean to automate [getkc id="43" comment="IP"] integration? Ask four people in the industry and you’ll get four different answers. “The key issue is how you can assemble the hardware as quickly as you can out of pre-made pieces of IP,” said Charlie Janac, chairman and CEO of [getentity id="22674" e_name="Arteris"]. To Simon Rance, senior product manager in the ... » read more

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