Survey: eBeam Initiative Luminaries (formerly Perceptions) Survey Results


Survey of 77 industry luminaries across 42 different companies in July 2020 says net neutral COVID-19 business impact by 2021, with 24% positive vs 20% negative predictions. Click here to view the survey results. » read more

Improving EUV Underlayer Coating Defectivity Using Point-Of-Use Filtration


Authors: Aiwen Wu (Entegris, Inc. — United States), Hareen Bayana (Entegris GmbH — Germany), Philippe Foubert (imec — Belgium), Andrea Chacko and Douglas Guererro (Brewer Science, Inc. — United States). This paper describes efforts to leverage different filtration parameters, including retention ratings and membrane materials, to understand their impact on EUV underlayer coating defe... » read more

Probing UPF Dynamic Objects


This paper presents a new low-power verification methodology that makes it possible to continuously monitor the dynamic properties of UPF objects and utilize the information to develop custom low-power verification environments. Based on UPF information model concepts, it allows querying of any dynamic properties of UPF objects through a Tcl API and passing object information on to appropriatel... » read more

Artificial Intelligence For Sustainable And Energy Efficient Buildings


According to the goals of Europe’s green deal missions, the continent strives for becoming carbon neutral by 2050. Since buildings are a major contributor to the overall consumption of energy, improving their energy efficiency can be a key to a more sustainable and greener Europe. On the way towards zero-emission buildings, several challenges have to be met: In modern energy systems, several ... » read more

Demystifying MIPI C-PHY / D-PHY Subsystem


The newest member of the MIPI PHY family, the C-PHY, arrived in October 2014 to a mixture of excitement and apprehension. How would this new C-PHY compare to the MIPI D-PHY and M-PHY? What would differentiate the C-PHY, and would it be compatible enough with the D-PHY so that both could coexist in a hybrid subsystem? Now, years later, the answers are clear. This article will lay out... » read more

The Benefits Of Using Embedded Sensing Fabrics In AI Devices


AI chips, regardless of the application, are not regular ASICs and tend to be very large, this essentially means that AI chips are reaching the reticle limits in-terms of their size. They are also usually dominated by an array of regular structures and this helps to mitigate yield issues by building in tolerance to defect density due to the sheer number of processor blocks. The reason behind... » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA


Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Deploying Accurate Always-On Face Unlock


Accurate face verification has long been considered a challenge due to the number of variables, ranging from lighting to pose and facial expression. This white paper looks at a new approach — combining classic and modern machine learning (deep learning) techniques — that achieves 98.36% accuracy, running efficiently on Arm ML-optimized platforms, and addressing key security issues such a... » read more

Modified X-Band Push-Push Oscillator Simulation And Measurement


This eBook that explores the push-push oscillator configuration via harmonic balance (HB) computer simulation and test measurement. The unique operation of the push-push oscillator configuration is explored using HB simulation of spectral content and time-domain voltage waveforms. Dynamic load lines are investigated and utilized to explore peak signal excursion and degree of nonlinearity. Predi... » read more

Lower Process Nodes Drive Timing Signoff Software Evolution


A dramatic rise in design complexity has led to a slew of new signoff challenges that impact the ability to predictably meet PPA targets. Smaller technology nodes and larger design sizes have caused the number of corners and modes to grow exponentially leading to much longer turnaround times for timing signoff. Moreover, larger design sizes demand huge compute resources for timing signoff. I... » read more

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