category: Whitepapers

category: IoT, Security & Automotive

A Design Flow For Critical Embedded Systems
By Arteris - 23 Aug, 2023 - Comments: 0

Learn how IP encapsulation/packaging and interoperability using IP-XACT enabled automation in a complex verification & validation flow for aeronautical systems. Includes usage of these capabilities integrated using Arteris SoC integration technology: HW/SW codesign RTL, SystemC TLM and PSL Instruction Set Simulators Click here to read more. » read more

An Ideal Architecture For Always-On Camera Subsystems
By Expedera - 23 Aug, 2023 - Comments: 0

Always-sensing camera implementations offer a wealth of user experience advantages but face significant power, latency, and privacy concerns if not done right. To be successful, always-sensing camera subsystems must be architected to preserve battery life and to ensure privacy and security while delivering key user experience improvements. In a joint white paper with Rambus, Expedera discuss... » read more

The Four Foundational Pillars Of Calibre Shift Left Solutions For IC Design And Implementation Flows
By Siemens EDA - 23 Aug, 2023 - Comments: 0

As the semiconductor industry approaches a new era of digital transformation, design companies everywhere are turning to shift left strategies to address challenges that reduce design cycles while maximizing productivity, optimizing resource efficiency, ensuring design quality, and accelerating time to market. To overcome these challenges in IC design, Calibre shift left technologies include to... » read more

Novel Assist Layers To Enhance EUV Lithography Performance Of Photoresists On Different Substrates
By Brewer Science - 16 Aug, 2023 - Comments: 0

In EUV lithography, good resist patterning requires an assist layer beneath it to provide adhesion to prevent pattern collapse of small features and allow for higher aspect ratios. In addition, future EUV high numerical aperture (NA) is expected to require a decrease in thickness from the overall patterning stack. In this study, we are exploring a fundamentally new approach to developing an alt... » read more

AI Process Control Platform Enabling Next Generation Technology
By Tignis - 16 Aug, 2023 - Comments: 0

PAICe Monitor delivers AI and machine learning-enabled analytics for all stages of the semiconductor fabrication process lifecycle — from process development and ramp readiness, to high volume production. Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables process engineers to transform in-product fault diagnoses into continuous real-time monitoring—greatly improving ... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process
By Brewer Science - 14 Aug, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

Power Supply Noise Effects On Jitter In Clock Synchronous Systems With Emphasis On Memory Interfaces
By Synopsys - 09 Aug, 2023 - Comments: 0

Power Supply Noise Effects on Jitter in Clock Synchronous Systems with Emphasis on LPDDR5X, DDR5 and HBM3 In today's fast-paced digital world, the performance and capacity of high-speed memory has become crucial for a wide range of applications, from personal computing devices to data centers and high-performance computing systems. Designers face challenges in optimizing their designs ... » read more

Arm Total Compute: Engineering For Tomorrow’s Workloads
By Arm - 09 Aug, 2023 - Comments: 0

As consumers seek richer and more immersive experiences from their devices, the way compute systems are engineered must continually evolve to keep up. Arm Total Compute takes a solution-focused approach to system-on-chip design, moving beyond individual IP elements to design and optimize the system as a whole to enable more digital immersion experiences. Not only does this white paper dis... » read more

Ansys Charge Plus And Its Particle-In-Cell Solver
By Ansys - 09 Aug, 2023 - Comments: 0

SIMULATING SEMICONDUCTORS PARTICLE BY PARTICLE Plasma enhanced chemical vapor deposition (PE-CVD) and plasma etching are experimental techniques that leverage multiphysics for product development in the semiconductor industry. PE-CVD explicitly tackles the deposition of material on the surface of a wafer, such as a thin coating. A chemical with free radicals is placed on the surface of the ... » read more

Application For Non-Destructive Inspection
By Advantest - 08 Aug, 2023 - Comments: 0

IC chip internal measurement We attempted to apply the Hadatomo Z photoacoustic microscope for non-destructive inspection. One of the features of the HadatomoTM Z is simultaneous measurement using photoacoustic imaging and ultrasound imaging. By using an ultrasonic sensor with cen- ter frequency of 60 MHz, high-resolution imaging is possible. Photoacoustic imaging is a method to re... » read more

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