Edge Computing: Four Smart Strategies For Safeguarding Security And User Experience


It is a brave new world for enterprise networks. Smart devices are getting smarter, and edge computing is emerging as a viable way to reduce latency and improve performance. But as network architectures grow increasingly amorphous, what kind of impact will this have on security and performance? Download this white paper to discover how you can boost security, ensure quality of service, and futu... » read more

Heterogeneous Integration — Chiplets


Chiplets are a hot topic in the semiconductor industry, and to many, represent a paradigm change for chip designers and chip consumers alike. While heterogenous chiplets seem to have multiple advantages over traditional monolithic silicon and even homogenous chiplets, they still have not been mass-market deployed. This white paper, published in cooperation with the Global Semiconductor Alliance... » read more

An Automated Method For Adding Resiliency To Mission-Critical SoC Designs


Adding safety measures to system-on-chip (SoC) designs in the form of radiation-hardened elements or redundancy is essential in making mission-critical applications in the Aerospace and Defense (A&D), cloud, automotive, robotics, medical, and Internet-of-Things (IoT) industries more resilient against random hardware failures that occur. Designing for reliable and resilient functionality doe... » read more

L31 Embedded Core Extensions For Wireless And Connectivity


5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G), which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable multip... » read more

Reduce BOM Costs And Development Efforts for EtherCAT and Other Industrial Ethernet-Compatible Servo Systems


EtherCAT and other industrial Ethernet systems are expanding into fields beyond factory networks. On the other hand, the conventional implementation style of industrial Ethernet introduces the issue of rising BOM costs due to an increase in the number of required components. Moreover, supporting multiple industrial Ethernet protocols require more reusable software other than industrial Ethernet... » read more

Risks And Faults We Can Detect Using Machine Learning And Physics


In its earliest form, technicians manually took condition status readings from individual pieces of equipment and used them to shape maintenance conclusions. Today, critical machine and system data can be streamed continuously, automatically, from industrial internet of things (IIoT) sensors for real-time analytics, diagnostics, and suggested actions. Click here to read more. » read more

Enhancing Punch MLF Packaging with Edge Protection Technology


Quad Flat No-Lead (QFN) semiconductor packaging provides a small form factor as well as good electrical and thermal performance for low cost. Add demonstrated long term reliability to its benefits and it is easy to see why it has been a preferred automotive package for many years. QFNs are offered in saw and punch formats with punch being a well-defined and used solution in the automotive marke... » read more

Power Modules: A Four-Dimensional Design Challenge Calls For A Holistic Design And Verification Approach


A power module is a high-power switching circuit used in applications for electric vehicles, renewable energy, photovoltaics, wind power, and much more. Switching-element IGBTs and MOSFETs are used in these modules. This paper discusses different technologies and the associated design challenges to achieve complex power module requirements like high voltage resistivity up to 1700 V, high curren... » read more

ESD Co-Design For High-Speed SerDeS In FinFET Technologies


An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, including the phase from the completion of the silicon wafer processing to when the device (die) is assembled in the system. To avoid yield loss due to ESD damage during this early phase, on-chip ESD protection measures are applied to provide a certain degree of ESD robustness. The componen... » read more

Cold Plate Technology Comparison


New types of energy, such as wind and solar power, are being utilized more prevalently and hybrid cars/buses are being identified as a means of reducing carbon dioxide emissions resulting from the use of fossil fuels. Electronic systems like frequency converters for wind power and train utilization are required to provide ever higher levels of energy savings. As such, IGBT (insulated-gate bipol... » read more

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