category: Whitepapers

category: IoT, Security & Automotive

Affordable And Comprehensive Testing Of 3D Stacked Die Devices
By Siemens EDA - 07 Sep, 2022 - Comments: 0

Developers of high-end semiconductor products who face manufacturing limitations with respect to die sizes are investing in 3D stacked die technology. These advanced designs already push current design-for-test (DFT) solutions to the limits: tool run time, on-chip area demand, test pattern count, and test time. How then, can designers manage DFT for these new 3D devices? In this paper, we outli... » read more

Deep Learning To Classify And Establish Structure Property Predictions With PeakForce QNM Atomic Force Microscopy
By Bruker - 07 Sep, 2022 - Comments: 0

Machine learning and specifically, deep learning, is a powerful tool to establish the presence (or absence) of microstructure correlations to bulk properties with its ability to flesh out relationships and trends that are difficult to establish otherwise. This application note discusses the use of deep learning tools, to explore AFM phase and PeakForce Quantitative Nanomechanics (QNM) im... » read more

Open-Short Normalization Method For A Quick Defect Identification In Branched Traces With High-Resolution Time-Domain Reflectometry
By Advantest - 07 Sep, 2022 - Comments: 0

Time-domain reflectometry (TDR) that employs electro-optical sampling affords excellent resolution at the femtosecond level and exhibits a comprehensible impulse waveform, thereby allowing quick defect identification in a single trace. However, it remains challenging to identify a defect in a trace of multiple branches; the TDR waveform is complex. Generally, the TDR waveform of a defective uni... » read more

Methods To Overcome Limited Labeled Data Sets In Machine Learning-Based Optical Critical Dimension Metrology
By Onto Innovation - 07 Sep, 2022 - Comments: 0

With the aggressive scaling of semiconductor devices, the increasing complexity of device structure coupled with tighter metrology error budget has driven up Optical Critical Dimension (OCD) time to solution to a critical point. Machine Learning (ML), thanks to its extremely fast turnaround, has been successfully applied in OCD metrology as an alternative solution to the conventional physical... » read more

Better, Faster, And More Efficient Verification With The Power Of AI
By Synopsys - 07 Sep, 2022 - Comments: 0

Verification is often the most challenging part of the chip development process. Verification engineers have to balance quality of results (QOR) with time to results (TTR) and cost of results (COR). AI and ML technologies can play a significant part in increasing QOR, speeding up TTR, and reducing COR. This white paper outlines some of the major challenges for verification, describes how AI pro... » read more

Surfscan SP3/Ax Unpatterned Wafer Inspection Systems
By KLA - 07 Sep, 2022 - Comments: 0

Unpatterned wafer inspection systems are used for process qualification, tool qualification, tool monitoring, outgoing wafer quality control, incoming wafer quality control, and process debug. Learn more about a system from KLA that identify defects and wafer surface quality issues that affect the performance and reliability of chips manufactured for the automotive, IoT, 5G, consumer electronic... » read more

In-Design Thermal Analysis For MMIC And RF PCB Power Applications
By Cadence - 31 Aug, 2022 - Comments: 0

Next-generation wireless communication and radar systems often demand increased RF power within a smaller footprint to meet the performance and size requirements of their respective commercial and aerospace applications. As a result, RF front-end electronics are exposed to the risk of higher operating temperatures, which degrade RF performance and threaten device reliability. For many device ma... » read more

Enabling Model-Based Design For DO-254 Certification Compliance
By Siemens EDA - 31 Aug, 2022 - Comments: 0

The increasing prevalence and cost of projects that need to comply with the DO-254 standard is forcing companies to evaluate their development processes. This white paper shows a development approach to compliance using model-based design. It covers how a DO-254 workflow using model-based design promotes a consistent requirements-oriented project view and increases reuse of design and verificat... » read more

Rambus RT-640 Road To ISO 26262 Certification
By Rambus - 31 Aug, 2022 - Comments: 0

Modern vehicles incorporate an increasing number of complex integrated circuits. Failures in automotive systems can lead to damage to property, injury or loss of life. Ensuring the reliability of electronic systems is crucial, and the ISO26262 standard documents the requirements for determining automotive functional safety. This white paper details the process for how Rambus achieved the ISO262... » read more

Ensure Functional Safety Using Siemens’ AUTOSAR Solutions
By Siemens EDA - 29 Aug, 2022 - Comments: 0

As the prevalence of automated driving, electrification, and connected vehicle applications increases, the complexity of electrical and electronic (E/E) vehicle architecture is increasing, and vehicle safety requirements are becoming more demanding. Solution architects and engineers are looking for ways to manage it all. And they can, with the help of our comprehensive AUTOSAR solution that pro... » read more

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