category: Whitepapers

category: IoT, Security & Automotive

Advanced Outlier Die Control Technology In Fan-Out Panel Level Packaging Using Feedforward Lithography
By Onto Innovation - 12 Oct, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Fan-out panel level packaging (FOPLP) is one of the technologies that... » read more

High-Speed Image Processing By GPU
By Advantest - 12 Oct, 2021 - Comments: 0

By using CPU and GPU together, we have increased the speed of the filter function that is often used in imaging tests. This feature is provided by the Image Processing Library (IPL) in T2000 CMOS Image Sensor Solution. Next IPE, our new image processing engine that is currently in development, is about six times faster than IPE3 (Image Processing Engine 3), an existing engine. Author: Chiezo... » read more

Accelerating Verification Shift Left With Intelligent Coverage Optimization
By Synopsys - 12 Oct, 2021 - Comments: 0

Functional verification dominates semiconductor development, consuming the largest percentage of project time and resources. Team members look at the rate of design bug discovery, consider anecdotal information on the types of bugs that escaped to silicon in previous projects, and use their best judgment based on their years of experience to determine when to tape out. Above all, they look at v... » read more

Adaptive Computing In Robotics
By Xilinx - 08 Oct, 2021 - Comments: 0

Traditional software development in robotics is about programming functionality in the CPU of a given robot with a pre-defined architecture and constraints. With adaptive computing, instead, building a robotic behavior is about programming an architecture. By leveraging adaptive computing, roboticists can adapt one or more of the properties of its computing systems (e.g., its determinism, power... » read more

STMicroelectronics Methodology And Process For Heterogeneous Automotive Package Design
By Siemens EDA - 06 Oct, 2021 - Comments: 0

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In the automotive field, package designers need to... » read more

Using Machine Learning For Characterizations Of NoC Components
By Arteris - 06 Oct, 2021 - Comments: 0

Modern NoC (Network-on-Chip) is built of complex functional blocks, such as packet switches and protocol converters. PPA (performance/power/area) estimates for these components are highly desirable during early design phases – long before NoC gate level netlist is synthesized. At this stage a NoC component is a soft module, described by a set of architectural parameters, like the bit width of... » read more

HBM3 Memory: Break Through To Greater Bandwidth
By Rambus - 06 Oct, 2021 - Comments: 0

AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new hei... » read more

Building A Secured Internet Of Things
By Infineon - 06 Oct, 2021 - Comments: 0

The emerging Internet of Things (IoT) presents tremendous opportunities for innovative companies to deliver products and services to make industry more efficient, transportation safer and the everyday lives of people more convenient and fulfilling. But with great good there also can be great risk. Remote, intelligent monitoring and control for factories, homes, cities, and cars can increase eff... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

The 5 Essential Elements Of A Successful Software Security Initiative
By Synopsys - 06 Oct, 2021 - Comments: 0

Every organization that develops or integrates software needs a software security initiative—a blend of people, processes and tools that ensures applications and the data they process are secure. As customers, regulators, executives and boards of directors start asking for evidence of a formal approach to software security, organizations are trying to determine where to start, how to construc... » read more

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