Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization


In EUV lithography, spin-on silicon hardmasks have been widely used not only as etch transfer layers, but also as assist layers to enhance the lithographic performance of resist. In this study, we demonstrate a novel approach to functionalize spin-on silicon hardmasks by hybridizing them with functional groups through a sol-gel approach. By varying the concentration and type of the functional g... » read more

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging


Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Machine Learning At The Edge


Moving machine learning to the edge has critical requirements on power and performance. Using off-the-shelf solutions is not practical. CPUs are too slow, GPUs/TPUs are expensive and consume too much power, and even generic machine learning accelerators can be overbuilt and are not optimal for power. In this paper, learn about creating new power/memory efficient hardware architectures to meet n... » read more

AnastASICA — Towards Structured and Automated Analog/Mixed-Signal IC Design For Automotive Electronics


In our world based on electronics, the design of analog/mixed-signal (AMS) ICs is still mainly done manually. While digital design benefits from complete synthesis flows, analog lags far behind in terms of development time, cost, and risk. Analog design flows are hardly standardized and necessitate the four eye principle as important quality tool. Thus, highly experienced designers who incorpor... » read more

Designing Secure and Trusted Silicon Using Shift-Left in Verification


Designing secure silicon requires the design to be stable at all times, it shouldn't enter unknown states at any time to make it vulnerable from the security point of view. This paper identifies different sources of instability such as combinational feedback loop, unguarded clock and reset crossing, unguarded power crossing, etc. These instabilities can lead to unknown value propagation and hig... » read more

Kria K26 SOM: The Ideal Platform For Vision AI At The Edge


With various advancements in artificial intelligence (AI) and machine learning (ML) algorithms, many high-compute applications are now getting deployed on edge devices. So, there is a need for an efficient hardware that can execute complex algorithms efficiently as well as adapt to rapid enhancements in this technology. Xilinx's Kria K26 SOM is designed to address the requirements of executing ... » read more

MIPI Drives Performance for Next-Generation Displays


In late 2000, Nokia announced its iconic 3310 handset which featured an 84×48-pixel pure monochrome display. Seven years later, Apple unveiled its first iPhone with a 90mm (3.5”) screen and 320×480-pixel resolution (at 163 ppi). Cameras and high-quality displays quickly became the de-facto standard for smartphones by the mid-2000s. However, proprietary interface solutions for connecting cam... » read more

Recommendations And Solutions For USB-C PD Chargers


The recent enhancements and technology advancements in the charger domain have made engineers face new challenges in their daily lives. Higher efficiency, smaller footprint with the same output power, or more power in the same footprint are among the key challenges in contemporary charger designs. In this whitepaper, Infineon provides engineers with an overview of different solutions in the USB... » read more

Study On High-Performance Computing Usage For Engineering Simulation


Simulation will play a critical role in the development of new market disrupting technology, from autonomous vehicles to 5G cellular networks, and the need for on-premises or cloud-based HPC resources to support those efforts is only going to increase. This white paper explores: How companies are using HPC-based simulation. The effect of the COVID-19 pandemic on HPC usage and adoptio... » read more

Acoustic Metrology for Fine Pitch Microbumps in 3D IC


The continuing shift to 3D integration requires formation of electrical interconnects between multiple vertically stacked Si devices to enable high speed, high bandwidth connections. Microbumps and through silicon vias (TSVs) enable the high-density interconnects for die-to-die and die-to-wafer stacking for different applications. In this paper, we present acoustic metrology techniques for the ... » read more

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