category: Whitepapers

category: IoT, Security & Automotive

FPGA Prototyping: Supersizing Scale And Performance
By Synopsys - 11 May, 2021 - Comments: 0

Given the cost of re-spinning a system-on-chip (SoC), semiconductor companies have always looked for ways to verify and validate the SoC before tape-out. Prototyping using field programmable gate arrays (FPGAs) became a key methodology as part of this pre-silicon verification and validation effort. Click here to read more. » read more

A Novel Memory Test System With An Electromagnet For STT-MRAM Testing
By Advantest - 11 May, 2021 - Comments: 0

We have successfully developed, for the first time, a new memory test system for STT-MRAM at wafer-level where an electromagnet is combined with a memory test system and a 300 mm wafer prober. In the developed memory test system, an out-of-plane magnetic field up to ±800 mT can be applied on 10 x 10 mm2 in the 300 mm wafer with distribution of less than 2.5%. We demonstrated that the electroma... » read more

Monitor And Control Automotive Devices With Over-The-Air Updates
By Siemens EDA - 05 May, 2021 - Comments: 0

Modern vehicles are complex electronic devices that require regular over-the-air (OTA) system and software updates to ensure their correct and safe operation. This paper discusses the need for OTA and the Siemens solutions that ensure OTA updates are secure and meet all regulations and standards. To read more, click here. » read more

MACsec Explained: Securing Data in Motion
By Rambus - 05 May, 2021 - Comments: 0

For end-to-end security of data, it needs to be secured when at rest (processed or stored in a device) and when in motion (communicated between connected devices). For data at rest, a hardware root of trust anchored in silicon provides the foundation upon which all data security is built. Similarly, for data in motion, security anchored in hardware at the foundational communication layer prov... » read more

Penetration Testing: A Buyer’s Guide
By Synopsys - 05 May, 2021 - Comments: 0

Data breaches continue to plague organizations—whether they’re targeted attacks from outside or malicious insiders. According to the 2020 IBM “Cost of Data Breach” report, 52% of breaches were caused by a malicious attack and the average total cost of a breach was $3.86 million. Many of these breaches are the result of combinations of errors or vulnerabilities, with attackers working th... » read more

Enabling The Next Step In IC Test And Monitoring
By Siemens EDA - 21 Apr, 2021 - Comments: 0

Product lifecycle management (PLM) is a well-established concept across many industries that aims to manage the entire lifecycle of a product from inception through design, realization, deployment, and field service, right through to end-of-life activities such as final disposal. More recently, these principles are being applied by the semiconductor industry because electronics continue to p... » read more

Early, Accurate, Signoff-Correlated Power Analysis
By Synopsys - 21 Apr, 2021 - Comments: 0

Power estimation has always been a fundamental part of semiconductor development, but it has grown in importance in recent years. Virtually every application domain has power limitations that must be satisfied before a chip is fabricated. There is no effective way to fix power issues in the lab or in the field, so pre-silicon estimation must be accurate. The short development cycles for many ty... » read more

Best Practices For Efficient And Effective Planar EM Simulation
By Cadence - 21 Apr, 2021 - Comments: 0

Designers of today’s complex, multi-featured communications products require accurate and fast electromagnetic (EM) simulation to deliver cost-effective, high-performance products to market in ever-shrinking windows of opportunity. The Cadence AWR AXIEM 3D planar method-of-moments (MoM) EM analysis simulator within the AWR software portfolio delivers the accuracy, capacity, and speed designer... » read more

What You Should Consider When Choosing A Processor IP Core
By Codasip - 21 Apr, 2021 - Comments: 0

Most integrated circuits include at least one processor core and some embedded software. In the case of more complex systems-on-chip (SoC), there may be application processors running the main software, and operating system plus multiple specialised subsystems handling functions such as communications, security, and sensors. Requirements for processing vary considerably and there is a wide choi... » read more

Advanced Packaging For Improved Network Communications
By Amkor - 14 Apr, 2021 - Comments: 0

The global demand for data increases day-by-day. At the same time, the data transmission rate will increase to exceed 1 Terabits per second (Tbps) near the middle of this decade. To address this situation and provide a third alternative, engineers are increasingly looking into the chiplet approach with multiple smaller dies integrated in a single package. Only the logic portion that needs to... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy