Advanced mm-Wave And Terahertz Measurements With Cascade Probe Stations


The strong market needs to embed multiple functionalities from different semiconductor processing technologies into a single system continue to drive demands for more advanced 3DIC packaging technologies. Dimensions of copper pillar micro-bumps are consistently reduced in every new technology node to facilitate the 3D stacking of multiple dies so that overall system performance can be improved.... » read more

Automotive Safety Island


The promise of autonomous vehicles is driving profound changes in the design and testing of automotive semiconductor parts. Automotive ICs, once deployed for simple functions like controlling windows, are now performing complex functions related to advanced driver-assist systems (ADAS) and autonomous driving applications. The processing power required results in very large and complex ICs that ... » read more

CXL Memory Interconnect Initiative: Enabling A New Era of Data Center Architecture


In response to an exponential growth in data, the industry is on the threshold of a groundbreaking architectural shift that will fundamentally change the performance, efficiency and cost of data centers around the globe. Server architecture, which has remained largely unchanged for decades, is taking a revolutionary step forward to address the growing demand for data and the voracious performan... » read more

The Matter Standard: Implementing Improved Security And Connectivity For The Smart Home


The smart home continues to evolve in available functions and complexity as several different connectivity protocols from numerous suppliers target a variety of products for use in smart homes. However, many consumers (71% according to incontrol) acknowledge fear of their personal information being stolen while using smart home products. At the same time, ease of use for user-installed products... » read more

Supply Chain Resiliency


In response to current events, many customers have reached out to Synopsys with questions about managing risk related to vulnerabilities in software, services, and hardware sourced from their vendors. This aspect of securing your infrastructure affects many, if not all, of the domains in cyber security—from legal and governance frameworks to advanced threat detection. This white paper can... » read more

ACAP At The Edge With The Versal AI Edge Series


This white paper introduces the AI Edge series to the Versal ACAP portfolio, a domain-specific architecture (DSA) that meets the strenuous demands of systems implemented in the 7nm silicon process. This series is optimized to meet the performance-per-watt requirements of edge nodes at or near the analog-digital boundary. Here, immediate response to the physical world is highly valued, and in ma... » read more

SoC Verification From Pre-Fabrication To The Over-the-Air Update


The recent new of attacks on system infrastructures serves to highlight that hardware vulnerabilities in the supply chain are not only possible but inevitable if proper precautions are ignored. Verification throughout the entire supply chain is necessary to ensure the safety and security of hardware. Starting as early as the pre-fabrication stage, vulnerabilities, if left unchecked, can be an o... » read more

Internet of Things (IoT)


The wide range of internet of things (IoT) applications in development today are made possible by smart devices operating across different network configurations, frequencies, power requirements, and protocols. Developing cost-effective IoT solutions requires a smart, organized approach to radio and antenna integration within a design flow that may have little to do with traditional RF product ... » read more

Verilog HDL And Its Ancestors And Descendants


This paper describes the history of the Verilog hardware description language (HDL), including its influential predecessors and successors. Since its creation in 1984 and first sale in 1985, Verilog has completely revolu- tionized the design of hardware. Verilog enabled the development and wide acceptance of logic synthesis. For large-scale digital logic design, previous schematic-based techniq... » read more

Using A System Technology Co-Optimization (STCO) Approach For 2.5/3D Heterogeneous Semiconductor Integration


With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the system technology co-optimization (STCO) concept, where a SoC type system is disaggregated, or partitioned, into smaller modules (also known as chiplets) that can be asynchrono... » read more

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