Chip Industry Technical Paper Roundup: Apr. 29

5nm SRAM minimum supply voltage; particle-induced mask diffraction on EUV lithography; chiplet placement and routing; HW-based heterogeneous memory management for LLM inference; real-world HW security attacks; controlled shared memory isolation; digital twins for vehicular prototyping.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
An Investigation of Minimum Supply Voltage of 5nm SRAM from 300K down to 10K IIT, UC Berkeley and Munich Institute of Robotics and Machine Intelligence
Impact of Sn Particle-Induced Mask Diffraction on EUV Lithography Performance Across Different Pattern Types Hanyang University and Paul Scherrer Institute
Advanced Chiplet Placement and Routing Optimization considering Signal Integrity KAIST
Hardware-based Heterogeneous Memory Management for Large Language Model Inference KAIST and Stanford University
The Pains of Hardware Security: An Assessment Model of Real-World Hardware Security Attacks TU Wien and TÜV Austria
Controlled Shared Memory (COSM) Isolation: Design and Testbed Evaluation Arizona State University and Intel Corporation
Digital Twin Technologies for Vehicular Prototyping: A Survey Central Michigan University and University of Florida

Find more semiconductor research papers here.



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