Chip Industry Technical Paper Roundup: July 7

2.5D multi foundry chiplet solution; in-memory computation of CNN inferences with racetrack memory; high-performance p-type 2D FETs by nitric oxide doping; collusion threats in the IC supply chain; HW security verification; data-driven power modeling; stacking persistent embedded memories based on AOS transistors upon GPGPU platforms.

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New technical papers recently added to Semiconductor Engineering’s library:

Name of Paper Research Organizations
System-Level Validation Across Multiple Platforms to build a 2.5D Multi Foundry Chiplet Solution Intel Corporation
Hardware-software co-exploration with racetrack memory based in-memory computing for CNN inference in embedded systems National University of Singapore, A*STAR, Chinese Academy of Sciences, and Hong Kong University of Science and Technology
High-performance p-type bilayer WSe2 field effect transistors by nitric oxide doping Penn State University and Florida International University
Analyzing Collusion Threats in the Semiconductor Supply Chain NIST and University of Maryland
FastPath: A Hybrid Approach for Efficient
Hardware Security Verification
RPTU Kaiserslautern-Landau and UC San Diego
Data-driven power modeling and monitoring via hardware performance counter tracking ETH Zürich, Scuola Superiore Sant’Anna, RISE Research Institutes of Sweden and University of Bologna
CMOS+X: Stacking Persistent Embedded Memories based on Oxide Transistors upon GPGPU Platforms Georgia Tech

Find more semiconductor research papers here.



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