Customizing a LLM for VHDL design; HW-centric analysis of DeepSeek’s multi-head latent attention; high-density polymer waveguides with silicon photonics for CPO; RISC-V energy efficiency of superscalar OoO execution; V-NAND PUFs; bond wave speed in wafer bonding; HW-efficient attention for fast decoding; PFAS modeling in IC manufacturing.
New technical papers recently added to Semiconductor Engineering’s library:
| Name of Paper | Research Organizations |
|---|---|
| Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors | IBM |
| Hardware-Centric Analysis of DeepSeek’s Multi-Head Latent Attention | KU Leuven |
| Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics | imec and Ghent University |
| Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, Out-of-Order Execution | ETH Zurich, Università di Bologna and Univ. Grenoble Alpes, Inria |
| Concealable physical unclonable functions using vertical NAND flash memory | Seoul National University and SK hynix |
| Factors determining bond wave speed in wafer bonding | Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics |
| Modeling PFAS in Semiconductor Manufacturing to Quantify Trade-offs in Energy Efficiency and Environmental Impact of Computing Systems | Harvard University and MBZUAI |
| Hardware-Efficient Attention for Fast Decoding | Princeton University |
Find more semiconductor research papers here.
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