Chip Industry’s Technical Paper Roundup: October 3

Next-gen AI accelerator design; LLM-assisted formal verification; neuromorphic HW for heterogeneous SoC; layered semimetals for heterogeneous electronics; friction between graphene and atomic force microscope tip; cryogenic IMC for quantum processors; modeling for EDA using ML; HW Trojan detection.

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New technical papers recently added to Semiconductor Engineering’s library:

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