Using USB 3.1’s Multiple INs To Reach 10 Gbps Data Rates

By Matthew Myers - 16 Jan, 2014 - Comments: 0

In January 2013, the USB-IF announced USB 3.1, a new generation of the protocol that will double USB 3.0 data throughput performance to 10 Gbps. In addition to this increased speed, the specification requires compatibility with existing cables, connectors, software stacks, and device class protocols. USB 3.1 products must support existing 5 Gbps and new 10 Gbps hubs and devices, as well as olde... » read more

Chipmakers Getting Serious About Integrated Photonics

This technology could enable the next wave of Moore’s Law. What’s needed to make that happen?

by Brian Bailey

HBM Takes On A Much Bigger Role

High-bandwidth memory may be a significant gateway technology that allows the industry to make a controlled transition to true 3D design and assembly.

by Brian Bailey

Many Chiplet Challenges Ahead

Assembling systems from physical IP is gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work.

by Brian Bailey