tag: 2.5D

eSilicon Builds ASIC Business On Leading-Edge Chip Design
By eSilicon - 21 Feb, 2018 - Comments: 0

How advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company has many leading system companies as custome... » read more

New Thermal Issues Emerge
By Ann Mutschler - 12 Feb, 2018 - Comments: 0

Thermal monitoring is becoming more critical as gate density continues to increase at each new node and as chips are developed for safety critical markets such as automotive. This may sound counterintuitive because the whole point of device scaling is to increase gate density. But at 10/7 and 7/5nm, static current leakage is becoming a bigger issue, raising questions about how long [getkc id... » read more

What’s In The Package?
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

In Case You Missed It
By Mike Gianfagna - 25 Jan, 2018 - Comments: 0

We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design
By eSilicon - 24 Jan, 2018 - Comments: 0

This paper explores how advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company we profile is eSilicon, which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company ha... » read more

Follow The Moving Money
By Ed Sperling - 18 Jan, 2018 - Comments: 1

Semiconductor economics are changing by market, by region, and by product node and packaging type, adding new complexity into decisions about which technology to use for which products and why. Money is the common denominator in all of these decisions, whether it's measured by return on invested capital, quarterly profits, or long-term investments that can include acquisitions, organic growt... » read more

Predictions: Manufacturing, Devices And Companies
By Brian Bailey - 18 Jan, 2018 - Comments: 0

Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

Advanced Packaging Still Not So Simple
By Ed Sperling - 08 Jan, 2018 - Comments: 1

The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

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