tag: AI

Heterogeneous Design Creating Havoc With Firmware Versions
By Ed Sperling - 01 Apr, 2019 - Comments: 0

Adding different kinds of processing elements into chips is creating system-level incompatibilities because of sometimes necessary, but usually uncoordinated, firmware updates from multiple vendors. In the past, firmware typically was synchronized with other firmware and the chip was verified and debugged. But this becomes much more difficult when multiple heterogeneous processing elements a... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 29 Mar, 2019 - Comments: 0

Internet of Things Organizers for the Internet of Things World 2019 conference, coming up on May 13-16 in Santa Clara, Calif., surveyed more than 100 IoT leaders in various industries. Implementation (34%) and security (25%) were the highest concerns for the respondents. Those were followed by initial purchase (17%), scalability (10%), business buy-in (8%), and upkeep costs (3%). Two-thirds of... » read more

Utilizing More Data To Improve Chip Design
By Ann Mutschler - 28 Mar, 2019 - Comments: 0

Just about every step of the IC tool flow generates some amount of data. But certain steps generate a mind-boggling amount of data, not all of which is of equal value. The challenge is figuring out what's important for which parts of the design flow. That determines what to extract and loop back to engineers, and when that needs to be done in order to improve the reliability of increasingly com... » read more

The Automation Of AI
By Brian Bailey - 28 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the role that EDA has in automating artificial intelligence and machine learning with Doug Letcher, president and CEO of Metrics; Daniel Hansson, CEO of Verifyter; Harry Foster, chief scientist verification for Mentor, a Siemens Business; Larry Melling, product management director for Cadence; Manish Pandey, Synopsys fellow; and Raik Brinkmann, CEO ... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 22 Mar, 2019 - Comments: 0

Internet of Things Second-tier cities in the U.S. that can’t attract projects like the Amazon HQ2 are welcoming the testing of autonomous vehicles, smart city technology, and advanced surveillance techniques, this analysis notes. What do they get in return? Much of the time, little or nothing. And bad things can happen. People have been throwing objects at Waymo vehicles in Chandler, Ariz., ... » read more

Power/Performance Bits: Mar. 19
By Jesse Allen - 19 Mar, 2019 - Comments: 0

Explainable AI Researchers from Technische Universität Berlin (TU Berlin), Fraunhofer Heinrich Hertz Institute (HHI), and Singapore University of Technology and Design (SUTD) propose a pair of algorithms to help determine how AI systems reach their conclusions. Explainable AI is an important step towards practical applications, argued Klaus-Robert Müller, Professor for Machine Learning at... » read more

The Growing Challenge Of Thermal Guard-Banding
By Ann Mutschler - 18 Mar, 2019 - Comments: 1

Guard-banding for heat is becoming more difficult as chips are used across a variety of new and existing applications, forcing chipmakers to architect their way through increasingly complex interactions. Chips are designed to operate at certain temperatures, and it is common practice to develop designs with some margin to ensure correct functionality and performance throughout the operat... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 15 Mar, 2019 - Comments: 0

Internet of Things Apple purchased a portfolio of eight granted and pending patents that belonged to Lighthouse AI, a smart home security camera startup that ceased operations near the end of 2018. The portfolio was acquired at about the same time, according to the U.S. Patent & Trademark Office; financial terms weren’t revealed. Also not disclosed, as usual, is what Apple will do with t... » read more

Using Less Power At The Same Node
By Brian Bailey - 14 Mar, 2019 - Comments: 0

Going to the next node has been the most effective way to reduce power, but that is no longer true or desirable for a growing percentage of the semiconductor industry. So the big question now is how to reduce power while maintaining the same node size. After understanding how the power is used, both chip designers and fabs have techniques available to reduce power consumption. Fabs are makin... » read more

Memory Tradeoffs Intensify in AI, Automotive Applications
By Ann Mutschler - 14 Mar, 2019 - Comments: 0

The push to do more processing at the edge is putting a strain on memory design, use models and configurations, leading to some complex tradeoffs in designs across a variety of markets. The problem is these architectures are evolving alongside these new markets, and it isn't always clear how data will move across these chips, between devices, and between systems. Chip architectures are becom... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy