Bridging Hardware And Software


Methodology and reuse are two fairly standard concepts when it comes to semiconductor design, but they're viewed completely differently by hardware and software teams. It's a given that hardware and software have different goals and opinions about how best to do design. And while all agree that a single methodology can pay dividends in future chips, there is disagreement over who should shap... » read more

Thinking Outside The Chip


Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Predictions For 2016: Markets


Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Equipment Sales Were Mixed Bag In 2015


Semiconductor equipment billings were up in Q3 of 2015, the most recent statistics available from SEMI, compared with Q3 of 2014. The strongest growth was reported in China, which grew 63%, and Taiwan, which was up 22%. Billings in North America were down 23%, while in Korea they were down 22%. Europe was down 36%. Japan was up 2%, which is consistent with the growth seen in recent EDA C... » read more

Executive Insight: Sehat Sutardja


Sehat Sutardja, chairman and CEO of Marvell, sat down with Semiconductor Engineering to talk about new approaches for design and memory and why costs and time to market are forcing changes in Moore's Law. What follows are excerpts of that conversation. SE: What was behind your move into modular packaging? Sutardja: The cost of building chips is getting out of hand. As we make things more ... » read more

What Goes Wrong With IP


Semiconductor Engineering sat down to talk about the future of IP with Rob Aitken, R&D fellow at [getentity id="22186" comment="ARM"]; Mike Gianfagna, vice president of marketing at [getentity id="22242" e_name="eSilicon"]; Judd Heape, vice president of product applications at Apical; and Bernard Murphy, an independent industry consultant. What follows are excerpts of that discussion, which... » read more

EDA, IP Numbers Strong


EDA and IP sales were 7.1% in Q3 across all major segments and all geographical regions, increasing to $1.957 billion compared with $1.828 billion in the same period in 2014, according to just-released numbers from the EDA Consortium. The four-quarter moving average was up 8.8%. "This was an excellent quarter for EDA," said Wally Rhines, board sponsor for the EDA Consortium's Market Statisti... » read more

Smarter Cities


One of the benefits touted by IoE proponents is that smart cities will improve the quality of life and make cities more “livable.” The concept is appealing, and if it comes to pass as visionaries hope, the smart city of the future will be a virtual cornucopia of convenience and efficiency. Residents and vistors will never be lost with the proliferation of location technologies, which als... » read more

CEO Outlook: 2016


Semiconductor Engineering talked with 10 CEOs from all sides of the Semiconductor Industry for a high-level view of what to expect this year—good and bad. What follows are excerpts of those conversations, which were compiled over the past month. Scott McGregor, president and CEO of Broadcom "We're going to see more M&A. In the past, you only did deals that made sense strategically or ... » read more

What Goes Wrong With IP


Semiconductor Engineering sat down to talk about the future of IP with Rob Aitken, R&D fellow at [getentity id="22186" comment="ARM"]; Mike Gianfagna, vice president of marketing at [getentity id="22242" e_name="eSilicon"]; Judd Heape, vice president of product applications at Apical; and Bernard Murphy, an independent industry consultant. What follows are excerpts of that discussion, which... » read more

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