tag: Cadence

What Happened To Execute-in-Place?
By Bryon Moyer - 25 Aug, 2020 - Comments: 0

Executing code directly from non-volatile memory, where it is stored, greatly simplifies compute architectures — especially for simple embedded devices like microcontrollers (MCUs). However, the divergence of memory and logic processes has made that nearly impossible today. The term “execute-in-place,” or ”XIP,” originated with the embedded NOR memory in MCUs that made XIP viable. ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Aug, 2020 - Comments: 0

Tools & IP SiFive announced OpenFive, a self-contained and autonomous business unit that will offer custom silicon solutions with differentiated IP. OpenFive will be led by Dr. Shafy Eltoukhy, SVP, and general manager of OpenFive. OpenFive debuted with a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chipset based designs for networking, HPC, and AI markets. The D2D p... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

Monitoring Chips After Manufacturing
By Brian Bailey - 19 Aug, 2020 - Comments: 2

New regulations and variability of advanced process nodes are forcing chip designers to insert additional capabilities in silicon to help with comprehension, debug, analytics, safety, security, and design optimization. The impact of this will be far-reaching as the industry discusses what capabilities can be shared between these divergent tasks, the amount of silicon area to dedicate to it, ... » read more

Blog Review: Aug. 19
By Jesse Allen - 19 Aug, 2020 - Comments: 0

Rambus' Scott Best digs into some of the most sophisticated attacks used to target and compromise security chips, such as laser voltage probing, focused ion beam editing, reverse engineering, and NVM extraction, and ways to counter them. Synopsys' Chris Clark proposes a way to identify problems earlier and better ensure safety and reliability in automotive SoCs by moving from a linear develo... » read more

From Cloud To Cloudlets
By Ed Sperling - 17 Aug, 2020 - Comments: 0

Cloudlets, or mini-clouds, are starting to roll out closer to the sources of data in an effort to reduce latency and improve overall processing performance. But as this approach gains steam, it also is creating some new challenges involving data distribution, storage and security. The growing popularity of distributed clouds is a recognition that the cloud model has limitations. Sending the ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Aug, 2020 - Comments: 0

Cadence added new machine learning functionality to its Xcelium Logic Simulator to speed verification closure on randomized regressions. Xcelium ML directly interfaces to the simulation kernel and learns iteratively over an entire simulation regression, guiding the Xcelium randomization kernel on subsequent regression runs to achieve matching coverage with reduced simulation cycles. Kioxia adop... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 14 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Maxim Integrated’s new USB-C Power Delivery products — the MAX77958 USB-C PD controller and the MAX77962 28W buck-boost charger — are aimed at devices, such as IoT or mobile phones, that need more power or for fast charging. To shave time off development and cost when changing from single-cell to two-series cell architectures, these are USB-... » read more

Redefining The Power Delivery Network
By Brian Bailey - 13 Aug, 2020 - Comments: 3

Reliably getting power around a package containing multiple dies, potentially coming from multiple sources, or implemented in diverse technologies, is becoming much more difficult. The tools and needed to do this in an optimized manner are not all there today. Nevertheless, the industry is confident that we can get there. For a single die, the problem has evolved slowly over time. "For a ... » read more

Make Acute Angles A Sharp Problem Of The Past
By Tyler Lockman - 13 Aug, 2020 - Comments: 0

Sharp angles, whether they create a spike in a poured shape or form an acid trap between two different pieces of metal, are a problem for us all. As designers, we will go out of our way to try and avoid creating these situations; they will still creep into your design despite the best of intentions. How, then, can you efficiently rid your design of them with the minimal change to your routin... » read more

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