Using CAA And DFM Scoring To Improve Manufacturing Success

By Mentor, a Siemens Business - 26 Sep, 2018 - Comments: 0

Critical area analysis and design for manufacturing scoring both offer designers actionable information they can use to improve their designs to prevent low-yield issues in the foundry. At the same time, they provide the foundry with information they can use for process improvement. Learn how fabless designers, foundries, and integrated device manufacturers can all benefit from addressing manuf... » read more

Fabs Meet Machine Learning

By Mark LaPedus - 19 Jul, 2018 - Comments: 2

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to discuss Moore’s Law and photomask technology. Fujimura also explained how artificial intelligence and machine learning are impacting the IC industry. What follows are excerpts of that conversation. SE: For some time, you’ve said we need more compute power. So we need faster chips at advanced nodes, but cost... » read more

Putting “Design” Back Into Design For Test In PCB Products

By Mentor, a Siemens Business - 11 Jun, 2018 - Comments: 0

Design for manufacturing (DFM) has become a proactive part of the design process, but the same cannot be said for DFT. Whereas “left-shifting” DFM has reduced manufacturing problems, increased yield, reduced scrap levels, and simplified engineering rework, testability-related improvements have stayed flat during that same time. Unfortunately, as assembly costs have come down, and test-relat... » read more

Mashup At 7nm

By Ed Sperling - 19 Apr, 2018 - Comments: 0

The merger of two standards organizations typically falls well below the radar of most engineers, but folding the ESD Alliance (formerly known as the EDA Consortium) into SEMI is a different kind of deal. Ever since the introduction of finFETs and multiple patterning, EDA tools have become an integral part of the development of new manufacturing processes. Without those tools, there is no po... » read more

New Patterning Options Emerging

By Mark LaPedus - 19 Apr, 2018 - Comments: 1

Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are developing self-aligned technologies based on a variety of new approaches. The latest approach involves self-aligned patterning techniques with multi-color material schemes, which are designed for us... » read more

Pattern-Based Analytics To Estimate And Track Yield Risk Of Designs Down To 7nm

By Cadence - 24 Jan, 2018 - Comments: 0

Topological pattern-based methods for analyzing IC physical design complexity and scoring resulting patterns to identify risky patterns have emerged as powerful tools for identifying important trends and comparing different designs. In this paper, previous work is extended to include analysis of layouts designed for the 7nm technology generation. A comparison of pattern complexity trends with r... » read more

Effective Management Of System Designs

By Ranjit Adhikary - 08 Nov, 2017 - Comments: 0

With the advent of the Internet-of-Things (IoT), system designs are slowly but surely becoming more complex. They now use heterogeneous architectures both on the System-on-Chip (SoC) and within a package. These systems typically have multiple different CPU cores, hardware accelerators, memories, network-on-chip (NoC) fabrics and numerous peripheral interfaces. Now, add to this the complexiti... » read more

The Week In Review: Design

By Jesse Allen - 15 Sep, 2017 - Comments: 0

Tools Cadence unveiled a new equivalence checking tool which features a massively parallel architecture capable of scaling to 100s of CPUs and adaptive proof technology that analyzes each partition and determines the optimal formal algorithm. According to the company, the Conformal Smart Logic Equivalence Checker provides an average of 4X runtime improvement with the same resources over the pr... » read more

Multi-Physics Combats Commoditization

By Brian Bailey - 14 Sep, 2017 - Comments: 0

The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison, analog circuits have increased in size by a factor of 10. The primary reason is that digital logic managed to isolate many of the physical effects from functionality, and to provide abstractions ... » read more

Reduce Verification Complexity In Low/Multi-Power Designs

By Mentor, a Siemens Business - 10 May, 2017 - Comments: 0

Accurate and efficient low-power and multiple-power domain verification requires both knowledge of the overall system’s power intent and careful tracking of signals crossing these power domains. Calibre PERC is the only comprehensive solution capable of providing transistor-level power intent verification without the need for SPICE simulation on both the schematic and layout side of your desi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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