tag: Fraunhofer IPMS

Fabricating FeFET Devices with Silicon-Doped Hafnium Oxide As A Ferroelectric Layer
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A new technical paper titled "Synergistic Approach of Interfacial Layer Engineering and READ-Voltage Optimization in HfO2-Based FeFETs for In-Memory-Computing Applications" was published by researchers at Fraunhofer IPMS, GlobalFoundries, and TU Bergakademie Freiberg. Abstract (partial) "This article reports an improvement in the performance of the hafnium oxide-based (HfO2) ferroelectric... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5
By Linda Christensen - 05 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

MAC Operation on 28nm High-k Metal Gate FeFET-based Memory Array with ADC (Fraunhofer IPMS/GF)
By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A technical paper titled "Demonstration of Multiply-Accumulate Operation With 28 nm FeFET Crossbar Array" was published by researchers at Fraunhofer IPMS and GlobalFoundries. Abstract "This letter reports a linear multiply-accumulate (MAC) operation conducted on a crossbar memory array based on 28nm high-k metal gate (HKMG) Complementary Metal Oxide Semiconductor (CMOS) and ferroelectric fi... » read more

Survey: 2022 Deep Learning Applications
By eBeam Initiative - 16 Mar, 2022 - Comments: 0

The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Dec, 2021 - Comments: 0

Intel intends to take Mobileye public in mid-2022 on a US market through an IPO of newly issued stock. The subsidiary, which Intel acquired in 2017, develops SoCs for ADAS and autonomous driving solutions. Mobileye has achieved record revenue year-over-year with 2021 gains expected to be more than 40 percent higher than 2020, highlighting the powerful benefits to both companies of our ongoing p... » read more

Week In Review: Design, Low Power
By Jesse Allen - 16 Jul, 2021 - Comments: 0

Tools Andes Technology certified Imperas reference models for the complete range of Andes IP cores with the new RISC-V P SIMD/DSP extension. The reference models can be used to evaluate multicore design configuration options for SoC architecture exploration and support early software development before silicon prototypes are available. Cadence's digital full flow was optimized and certified... » read more

Week In Review: Design, Low Power
By Jesse Allen - 28 May, 2021 - Comments: 0

Valens Semiconductor will become a publicly traded company on NYSE as VLN after a merger with PTK Acquisition Corp. Valens provides long-reach, high-speed video and data transmission for the audio-video and automotive industries. The transaction is expected to provide proceeds of approximately $240 million, including up to $115 million in trust from PTK Acquisition Corp. (assuming no redemption... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing
By eBeam Initiative - 17 Mar, 2021 - Comments: 0

The Survey: 2021 Deep Learning Applications List by eBeam Initiative members is a list of current deep learning efforts that are being used in photomask to wafer semiconductor manufacturing. Examples come from ASML, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, Siemens Industries Software, Inc., Siemens EDA, STMicroelectronics, and TASMIT. Published by the eBeam Initiative Membe... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Oct, 2020 - Comments: 0

Arm spun out Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation. Read more about the new company and its technology in Cerfe Labs: Spin-On Memory. Tools & IP ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Sep, 2020 - Comments: 0

Silvaco acquired the assets of Coupling Wave Solutions (CWS), including IP, patents, and analysis technologies. CWS provides tools for system-level interference analysis of complex SoCs that integrate analog, RF, and digital blocks. Silvaco said that the acquisition expands the company’s portfolio to address RF SOI (Silicon on Insulator) substrate analysis to accurately model and simulate noi... » read more

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