Manufacturing Bits: Nov. 2

By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

Why Mask Blanks Are Critical

By Mark LaPedus - 21 Oct, 2021 - Comments: 1

Geoff Akiki, president of Hoya LSI at the Hoya Group, sat down with Semiconductor Engineering to talk about optical and extreme ultraviolet (EUV) lithography as well as mask blanks. What follows are excerpts of that discussion. SE: Mask blanks are components that serve as the base or the substrate for a photomask. Why are they critical? Akiki: If you look at Hoya, we've been positioned as... » read more

Gearing Up For High-NA EUV

By Mark LaPedus - 21 Oct, 2021 - Comments: 2

The semiconductor industry is moving full speed ahead to develop high-NA EUV, but bringing up this next generation lithography system and the associated infrastructure remains a monumental and expensive task. ASML has been developing its high-numerical aperture (high-NA) EUV lithography line for some time. Basically, high-NA EUV scanners are the follow-on to today’s EUV lithography systems... » read more

Inside Intel’s Ambitious Roadmap

By Mark LaPedus and Ed Sperling - 23 Aug, 2021 - Comments: 2

Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of that discussion. SE: Intel recently disclosed its new logic roadmap. Beyond Intel 3, the company is working on Intel 20A. Wit... » read more

What’s Next In Fab Tool Technologies?

By Mark LaPedus - 12 May, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and other next-generation fab technologies with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fuj... » read more

EUV Pellicles Finally Ready

By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Manufacturing Bits: March 8

By Mark LaPedus - 08 Mar, 2021 - Comments: 0

Two-beam EUV lithography At the recent SPIE Advanced Lithography conference, Nikon gave a presentation on a two-beam extreme ultraviolet (EUV) lithography technology. Still in the conceptual phase, Nikon’s so-called EUV Projection Optical Wafer Exposure Ruling Machine, or EUV Power Machine, is designed for the 1nm node or so. The proposed system has a minimum resolution of 10nm for lines ... » read more

AI And High-NA EUV At 3/2/1nm

By Mark LaPedus - 16 Dec, 2020 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To vie... » read more

EUV Challenges And Unknowns At 3nm and Below

By Mark LaPedus - 19 Nov, 2020 - Comments: 1

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

Challenges Linger For EUV

By Mark LaPedus - 11 Nov, 2020 - Comments: 2

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Knowledge Centers
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tag: high-NA EUV