Ludo Deferm, VP of business development at IMEC, the Belgian research house, talks about changes ahead at future process nodes.
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S. Korea goes All In on AI; new Dresden power fab; Intel expansion; GM secures memory supply; AI power management funding; mature-node foundry capacity; 300mm fab equipment; McKinsey's map of strategic IC supply; security threats; AI burnout.
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnect protocols, requiring design tradeoffs and extra reliability measures.
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.
Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early and scale reliably.
Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It's a hardware/software/model co-development problem.
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.
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