Shaking Up The Green500


Barry Pangrle Last September, I wrote about the efficiency of IBM’s Power7+ architecture in my blog. IBM’s Sequoia supercomputer (a BlueGene/Q system) this past June had just shot to the top of the Supercomputing Top500 chart, clocking in at 16.32 petaflop/s on the Linpack benchmark. Other systems built around the IBM BlueGene/Q, Power BQC 16C 1.60GHz, Custom were also dominating the top o... » read more

Too Many Rules


By Ed Sperling The number of restrictive design rules that have to be dealt with by routers at 28nm and beyond has increased by several orders of magnitude compared with several generations ago, creating havoc in the automated tools world and slowing down the entire design process. At a time when market windows are shrinking, complexity is making it harder to meet even the old schedules. Th... » read more

Parallel Universes


There are no rules for knowing when to step out of the box. Good timing is everything, and that may have been one of the greatest talents of the late Steve Jobs. Knowing when, in Apple’s terminology, to “Think Different,” is every bit as important as the act of thinking differently—particularly when you realize that most of Apple’s big wins since the iPod stormed onto the consumer ele... » read more

Node Skipping Reaches New Heights


By Mark LaPedus For years, silicon foundries have rolled out their respective leading-edge processes roughly on a two-year cadence. The long-standing goal has been to keep foundry customers on a competitive price, power and performance curve. But as leading-edge chipmakers move from the 28nm node and beyond, the predictable process progression is changing. And the phenomenon of “node skip... » read more

New Incentives For Lowering Power


By Ed Sperling Despite all the focus by design teams on lowering power over the past few years, in many applications power is still the last consideration for many companies in the power-performance-area equation. That’s beginning to change, however, even for applications that in the past have not been particularly power-sensitive. There are several reasons for this shift. No. 1 on the li... » read more

ARM Vs. Intel, Phase Two


From 60,000 feet, ARM’s TechCon and the Intel Developer Forum look remarkably similar. The key message from both is a focus on improving performance in processors while significantly lowering power. Intel wants a piece of the mobile market so badly it can taste it. And ARM, which is the primary processing engine inside of the iPhone and one of a couple in Android-based devices—MIPS has ... » read more

Quantum Shifts


By Ed Sperling Intel, STMicroelectronics and some of the leading memory providers already are working on 10nm process technology, and advanced researchers in universities and industry-leading companies are looking at 7nm, 5nm and even beyond. Those who have glimpsed this technological future have similar observations. There is no single technology problem that has to be solved at these node... » read more

Moore’s Law Revisited


It’s no surprise that Moore’s Law can continue for many more generations. Intel’s road map already extends down to 5nm, most likely with carbon nanotube FETs, tunnel FETs, graphene TSVs and maybe even fully depleted SOI to replace bulk CMOS. The rest of the industry has been hanging back a node or two, gliding on the coattails of what Intel and companies like IBM, Samsung and STMicroel... » read more

Challenges Grow For EUV


By Mark LaPedus In the late 1990s, a group led by Intel launched a consortium to propel extreme ultraviolet (EUV) lithography into the mainstream. Originally, the consortium, dubbed the EUV LLC, envisioned the advent of EUV scanners that would move into production at the 65nm node. Clearly, the now-defunct consortium underestimated the difficulties and challenges associated with EUV. ASM... » read more

Beam Me Up


By Mark LaPedus For years, electron-beam tools have been struggling to keep up with photomask complexity, causing an alarming increase in write times and mask production costs. Intel and others recently warned that e-beams soon could reach their fundamental limits, thereby requiring the need for new solutions. And in the multiple patterning era, mask makers could see their capital costs soa... » read more

← Older posts Newer posts →