tag: Intel

Multicore Madness
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus Smartphones and tablets are migrating towards new and faster application processors, basebands, graphics chips and memories. In the cell-phone chipset area alone, there are a multitude of options and design considerations. Some devices combine the application processor and modem on the same chip. Some are separate devices. In addition, the architectures range from single- to... » read more

The Best Foundry Strategy
By Joanne Itow - 21 Feb, 2013 - Comments: 0

By Joanne Itow Today, foundries supply more than 20% of the silicon used to produce all the semiconductor products sold. The foundry impact has grown from only 10% in 1997 to 24% today. The significance of foundries is even more evident when focused on logic wafers alone. Figure 1. Foundry Wafers as a Percent of Total, IC’s, and IC’s Minus Memory [caption id="attachment_7339" align="... » read more

Taiwan: Aggressive Investments In Equipment For 2013-2014
By Christian Dieseldorff - 21 Feb, 2013 - Comments: 0

By Christian Gregor Dieseldorff Semiconductor equipment spending in 2012 declined significantly in the second half of the year as sluggish conditions in the global economy dampened some investments in the industry. Counter to this trend was spending in the Taiwan, which could come in at the $9.3 billion to $9.5 billion range. This represents $800 million more in equipment for Taiwan compared t... » read more

Math Questions
By Ed Sperling - 08 Feb, 2013 - Comments: 0

The race is on. GlobalFoundries, TSMC, Samsung, IBM and Intel are all neck deep in research, test chips, variability, lithography and three-dimensional transistor designs. For the first time, though, the goal very publicly has shifted from performance and area to energy efficiency. Being able to double battery life with existing performance over the next couple nodes could mean smart phones ... » read more

Experts Panel And Tutorial At DVCon
By Graham Bell - 31 Jan, 2013 - Comments: 0

Besides our usual exhibit at the Design and Verification Conference in Santa Clara at the end of next month, Real Intent has organized a panel and a half-day tutorial that highlights some of the changes happening in our industry—and which may have been overlooked. The panel addresses the interesting topic “Where Does Design End and Verification Begin?” The abstract states that design a... » read more

The CES Effect
By Frank Ferro - 31 Jan, 2013 - Comments: 0

By Frank Ferro CES draws a lot of attention. Everyone wants to be first to see the latest and greatest consumer products. If you don’t mind squeezing through the crowd, you can glimpse the startling picture quality of an OLED TV. Never mind viewing the quality of a 4K Ultra HDTV, at CES you can skip a generation and see what an 85” 8K UHDTV looks like. Talk about resolution! You also can e... » read more

Supersizing Wafers
By Ed Sperling - 24 Jan, 2013 - Comments: 0

By Katherine Derbyshire Get ready for 450mm wafers. First seriously considered in 2005, these supersized wafers, along with the equipment to handle, measure, and process them, have gradually made their way to the top of the semiconductor industry’s priority list. But what exactly does that mean? What will 450mm fabs look like, and how will they differ from the 300-mm fabs being built toda... » read more

Smartphones Dial Up New RF Processes
By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more

Lessons From Past Architecture Wars
By Marc David Levenson - 24 Jan, 2013 - Comments: 0

By Marc David Levenson There was an interesting IEEE panel discussion in Silicon Valley recently, reviewing the microprocessor architecture wars of the ’70s, ’80s and ’90s. How did the Intel x86 architecture become so dominant when there were other capable designs, including more efficient RISC (Reduced Instruction Set Computing) chips? How did the x86s overcome competition from Zilog, M... » read more

Tradeoffs On The Fly
By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler With classical bulk planar technology no longer shrinkable, the industry has been honing in on new ways to continue some scaling, achieve extra speed or better power while minimizing leakage. “To overcome the limits [of bulk planar technology] we need a different solution,” explained Giorgio Cesano, technology R&D marketing director at STMicroelectron... » read more

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