The Chiplet Race Begins


Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Return Of The Organic Interposer


Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Week In Review: Manufacturing, Test


Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Mixed Outlook For Semi Biz


Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Everything You Need to Know about FDSOI Technology


Over the past decades, transistor feature size has continuously decreased, leading to an increase in performance and a reduction in power consumption. Consumers have reaped the benefits, with superior electronic devices that have become increasingly useful, valuable, faster and more efficient. In recent years, as transistor feature size has shrunk below 10nm, it has become progressively more di... » read more

Benefits And New Applications For FD-SOI


Over the past decades, transistor feature size has continuously decreased, leading to an increase in performance and a reduction in power consumption. Consumers have reaped the benefits, with superior electronic devices that have become increasingly useful, valuable, faster and more efficient. In recent years, as transistor feature size has shrunk below 10nm, it has become progressively more di... » read more

Embedded Flash Scaling Limits


Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

Bridges Vs. Interposers


The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Fujitsu Semiconductor and United Microelectronics Corp. (UMC) announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies. In addition to the 15.9% of MIFS shares currently owned by UMC, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MI... » read more

Blog Review: June 27


Applied Materials' Sundeep Bajikar argues that to realize the full potential of AI, new computing architectures are necessary, otherwise AI will quickly become unaffordable. Synopsys' Iain Singleton considers why it may not always be necessary to start at the reset state during formal verification and how to use abstractions to get a head start on bug hunting. Cadence's Meera Collier look... » read more

← Older posts Newer posts →