Regaining The Edge In U.S. Chip Manufacturing


The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

Virtual Fabrication At 7/5/3nm


David Fried, vice president of computational products at Lam Research, digs into virtual fabrication at the most advanced nodes, how to create models using immature processes at new nodes, and how to fuse together data from multiple different silos. » read more

Week In Review: Manufacturing, Test


Chipmakers AMD and Xilinx have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion. With the proposed deal, AMD will enter the FPGA business, putting it further in competition with Intel. The transaction has been unanimously approved by the AMD and Xilinx boards. The transaction is expected to close by the end of calendar year 2021. U... » read more

Defect Challenges Grow For IC Packaging


Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

Winning The Global Race For Semiconductor Technology With Virtual Fabrication


Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete, since they are too expensive and time-consuming for the most advanced processes. The high cost of process development Most chip designers developing new products rely on existing manufacturing process... » read more

Much Smarter Manufacturing


Smart manufacturing is undergoing some fundamental changes as more sensors are integrated across fabs to generate more usable data, and as AI/ML systems are deployed to sift through that data and identify patterns and anomalies more quickly. The concept of smart manufacturing — also referred to as Industrie 4.0 in Europe, for the fourth industrial revolution — emerged from the World Econ... » read more

Impact Of EUV Resist Thickness On Local Critical Dimension Uniformities For <30nm CD Via Patterning


This paper describes the impact of extreme ultraviolet (EUV) resist thickness on <30 nm via local critical dimension uniformity (LCDU) measured during after development inspection (ADI) and after etch inspection (AEI). For the same post-etch CD targets, increasing resist thickness from 40 to 60 nm helped reduced CD variability. This work was performed via virtual fabrication using Coventor�... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs NXP has announced the grand opening of its 150mm (6-inch) RF gallium nitride (GaN) fab in Chandler, Ariz. This is said to be the most advanced fab dedicated to 5G RF power amplifiers in the United States. NXP’s new Chandler-based GaN fab is qualified now, with initial products ramping in the market and expected to reach full capacity by the end of 2020. GaN, a III-V techn... » read more

Blog Review: Sept. 30


Synopsys' Fred Bals takes a look open source projects that, while popular, go understaffed or underfunded, how that can lead to potential security vulnerabilities, and why users who rely on them should consider stepping up to contribute. In a video, Mentor's Colin Walls explains the basic concepts of multicore systems as it relates to embedded programming. Cadence's Paul McLellan ponders ... » read more

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