Research Bits: Jun. 2

By Jesse Allen - 02 Jun, 2026 - Comments: 1

Integrated valleytronics device Researchers from Monash University designed a valleytronics circuit that can generate, direct, and read light-based information on a single chip. Potential applications include quantum computing, advanced imaging, and optical communication systems. “We employ a straightforward stacking approach to integrate ultrathin materials with metasurfaces, overcoming ... » read more

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CPO Is Extending The Limits Of What’s Possible In AI Data Centers

Co-packaged optics technology will have a big impact on system power and the cost of data movement.

by Ann Mutschler

Flash Getting Stacked High-Bandwidth Version

Inspired by HBM, HBF could improve AI efficiency in 3D flash memory.

by Bryon Moyer

Can Edge AI Keep Up?

As models evolve faster than silicon cycles, experts weigh how much adaptability architects can afford without sacrificing power, area, or efficiency.

by Ann Mutschler

Chiplets Need A New Workflow

Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early and scale reliably.

by Ann Mutschler

HBM4E Raises The Bar For AI Memory Bandwidth

The speed at which accelerators can be fed with data has become just as critical as raw compute capability.

by Nidish Kamath

Scale Up, Scale Out Get a New Partner

For reaching farther into another data center, developers are now talking about scale-across.

by Bryon Moyer

AI Power on the Edge

Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It's a hardware/software/model co-development problem.

by Brian Bailey

Agentic AI Is Changing Data Center Architectures

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.

by Ann Mutschler

tag: optical data storage

Research Bits: Jun. 2

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