Steve Roddy, vice president of products for Arm’s Machine Learning Group, talks with Semiconductor Engineering about what different metrics actually mean, and why they can vary by individual applications and use cases.
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S. Korea goes All In on AI; new Dresden power fab; Intel expansion; GM secures memory supply; AI power management funding; mature-node foundry capacity; 300mm fab equipment; McKinsey's map of strategic IC supply; security threats; AI burnout.
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnect protocols, requiring design tradeoffs and extra reliability measures.
Apple-Intel is on, says Trump; Amkor's big win; Intel 18A-P; Amazon to sell its AI chips; Rambus' automotive RoT; Brewer's buy; VLSI Symposium tech; CHIPS Act funding; MIT sensor; RISC-V CPU fuzzing.
Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early and scale reliably.
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.
Processor architectures are evolving faster than ever, but they still lag the pace of AI development. Chip architects must predict what will be required tomorrow in designs today.
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