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Chipmakers Getting Serious About Integrated Photonics


Integrating photonics into semiconductors is gaining traction, particularly in heterogeneous multi-die packages, as chipmakers search for new ways to overcome power limitations and deal with increasing volumes of data. Power has been a growing concern since the end of Dennard scaling, which happened somewhere around the 90nm node. There are more transistors per mm², and the wires are thinne... » read more