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The Growing Challenge Of Thermal Guard-Banding


Guard-banding for heat is becoming more difficult as chips are used across a variety of new and existing applications, forcing chipmakers to architect their way through increasingly complex interactions. Chips are designed to operate at certain temperatures, and it is common practice to develop designs with some margin to ensure correct functionality and performance throughout the operat... » read more

Tightening Margins On Heat


Stephen Crosher, CEO of Moortec, talks with Semiconductor Engineering about the impact of more accurate measurements on power, performance and reliability of designs from 40nm all the way down to 3nm. https://youtu.be/VnX-TiaMVmI » read more