tag: TSMC

Changes In Chip Design
By Ernest Worthman - 07 Jan, 2016 - Comments: 0

We all know that sub-10nm is coming. But is that really what will define the next generation of semiconductors? Progress in semiconductor technology increasingly is not just about advancements in the hardware. It also involves advancements in applications and technologies peripheral to the devices themselves. That may sound counterintuitive, but going forward the technology, applications and... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Dec, 2015 - Comments: 1

Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

Foundries Face Challenges in 2016
By Mark LaPedus - 17 Dec, 2015 - Comments: 2

Generally, 2015 has been a challenging year in the foundry business. For one thing, the foundry industry will register modest growth in 2015. In addition, the foundry customer base is consolidating. And on the leading edge, foundries took longer than expected to ramp up their 16nm/14nm finFET processes. So, after an eventful year in 2015, what’s in store for the foundry business in 2016? I... » read more

Reflections On 2015
By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Dec, 2015 - Comments: 2

For years, China has been trying to get a domestic IC equipment industry off the ground, but it has experienced modest success in the arena. Now, China may take a new strategy—acquire fab tool makers. In what could be a sign of things to come, China’s Beijing E-Town Dragon Semiconductor Industry Investment Center has entered into a definitive agreement to acquire U.S.-based fab tool vendor ... » read more

Blog Review: Dec. 2
By Jesse Allen - 02 Dec, 2015 - Comments: 0

To celebrate ARM's 25th birthday, Neil Cooper teamed up with the Science Museum in London to feature 25 people or objects that were pivotal to the creation of modern technology. This week: James Clerk Maxwell and Heinrich Hertz. Ansys' Bill Vandermark delves deep into the oceans with energy-storing balloons and up to the sky on a diamond thread in his top technology and engineering articles ... » read more

Fan-Out Packaging Gains Steam
By Mark LaPedus - 23 Nov, 2015 - Comments: 1

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Nov, 2015 - Comments: 0

Is Moore’s Law alive or dead? That’s still a topic for debate. In any case, chipmakers continue to move to advanced nodes, but the transitions are taking longer. Even mighty Intel is struggling, based on what the company said about its 14nm finFET process during an investors meeting this week. In fact, Intel continues to struggle with its yields. “14nm yield is maturing; 14nm is still not... » read more

Why Packaging Matters
By Ed Sperling - 19 Nov, 2015 - Comments: 1

The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

ReRAM Gains Even More Steam
By Michael Watts - 19 Nov, 2015 - Comments: 0

The prospect of using the latest in finFET processing to enable embedded non-volatile memory (NWM) will be described by a team from TSMC and Tsing Hua University in Taiwan at the IEDM meeting on Dec. 8 in Washington, D.C. Embedded NVM has been the first commercial application of ReRam, with products from Panasonic and Terrazon. Industry leaders agree the creation of NVM as a seamless additio... » read more

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