tag: University of Bologna

Technical Paper Round-up: August 8
By Linda Christensen - 08 Aug, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=44 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Low Power HW Accelerator for FP16 Matrix Multiplications For Tight Integration Within RISC-V Cores
By Technical Paper Link - 03 Aug, 2022 - Comments: 0

This new technical paper titled "RedMulE: A Compact FP16 Matrix-Multiplication Accelerator for Adaptive Deep Learning on RISC-V-Based Ultra-Low-Power SoCs" was published by researchers at University of Bologna and ETH Zurich. According to their abstract: "One of the key stumbling stones is the need for parallel floating-point operations, which are considered unaffordable on sub-100 mW extre... » read more

Technical Paper Round-up: July 11
By Linda Christensen - 11 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=38 /]   Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

ISA Extension For Low-Precision NN Training On RISC-V Cores
By Technical Paper Link - 08 Jul, 2022 - Comments: 0

New technical paper titled "MiniFloat-NN and ExSdotp: An ISA Extension and a Modular Open Hardware Unit for Low-Precision Training on RISC-V cores" from researchers at IIS, ETH Zurich; DEI, University of Bologna; and Axelera AI. Abstract "Low-precision formats have recently driven major breakthroughs in neural network (NN) training and inference by reducing the memory footprint of the N... » read more

Power/Performance Bits: Nov. 9
By Jesse Allen - 09 Nov, 2020 - Comments: 0

Integrated transistor cooling Researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL) created a single chip that combines a transistor and microfluidic cooling system for more efficient transistor heat management. The team focused on a co-design approach for the electrical and mechanical aspects of the chip, bringing the electronics and cooling design together and aiming to extract... » read more

Internet of FD-SOI Things?
By Katherine Derbyshire - 18 Feb, 2016 - Comments: 0

Are fully-depleted silicon-on-insulator (FD-SOI) wafers having a moment? Certainly SOI wafers are not new. Soitec’s SmartCut layer transfer technology was patented in 1994, and wafers with implanted oxide layers were available before that. Still, adoption of SOI wafers has been limited. Though they offer improved device isolation and reduced parasitics, the increased wafer cost has been an ob... » read more

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