Week In Review: Design, Low Power


eSilicon debuted its 7nm high-bandwidth interconnect (HBI)+ PHY IP, a special-purpose hard IP block that offers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications such as chiplets. HBI+ PHY delivers a data rate of up to 4.0Gbps per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 2... » read more

Week In Review: Design, Low Power


M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

Week in Review: IoT, Security, Auto


Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week In Review: Design, Low Power


M&A Marvell will acquire Avera Semiconductor, the ASIC business of GlobalFoundries, for $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The agreements include transfer of Avera's revenue base, strategic design wins with infrastructure OEMs, and a new long-term wafer supply agreement between Globa... » read more

Week In Review: Design, Low Power


Tools & IP Cadence introduced the Tensilica Vision Q7 DSP, which provides up to 1.82 TOPS and is specifically optimized for simultaneous localization and mapping (SLAM). The DSP has a very long instruction word (VLIW) SIMD architecture, an enhanced instruction set supporting 8/16/32-bit data types and optional VFPU support for single and half precision, and a number of iDMA enhancements in... » read more

Week In Review: Design, Low Power


Tools & IP Cadence uncorked the latest version of JasperGold formal verification platform, providing improvements to the proof-solver algorithm and orchestration by using machine learning to select and parameterize solvers to enable faster first-time proofs and optimize successive runs for regression testing. Additionally, it increases design compilation capacity by over 2x with 50% reduct... » read more

Week In Review: Design, Low Power


IP Flex Logix debuted its new InferX X1 edge inference co-processor, which incorporates the interconnect technology from its eFPGAs and its inference-optimized nnMAX clusters. The chip focuses on high throughput in edge applications with a single DRAM and is optimized for small batch sizes in edge applications where there is typically only one camera/sensor. InferX X1 will be available as chip... » read more

Week In Review: Design, Low Power


ON Semiconductor will acquire Quantenna Communications for $24.50 per share in an all cash transaction, representing an equity value of approximately $1.07 billion and enterprise value of approximately $936 million. Quantenna, a maker of Wi-Fi chipsets, was founded in 2006 and went public in late 2016. Tools & IP Achronix completed testing and is now demonstrating the 112 Gbps SerDes th... » read more

Chip Industry In Rapid Transition


Wally Rhines, CEO Emeritus at Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about global economics, AI, the growing emphasis on customization, and the impact of security and higher abstraction levels. What follows are excerpts of that conversation. SE: Where do you see the biggest changes happening across the chip industry? Rhines: 2018 was a hot year for fab... » read more

December ’18 Startup Funding: Big Rounds As 2018 Ends


During the month of December, 16 startups had private funding rounds of $100 million and up, with half of them in the mobility area. Those 16 rounds totaled $3.2 billion as the year concluded. Before the holidays, the SoftBank Vision Fund invested $500 million in Cambridge Mobile Telematics, provider of the DriveWell platform used by insurers, vehicle fleets, wireless carriers, and others to... » read more

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