22nm Process Technology


Jamie Shaeffer, senior director of product line management at GlobalFoundries, talks about how FD-SOI compares with bulk technologies, where it will be used and why, and future stacking options. https://youtu.be/2i7GJRxcNRs » read more

New Roadmap For Electronics


Tech Talk: Melissa Grupen-Shemansky, CTO for SEMI’s FlexTech Group and Advanced Packaging program, looks at what’s changing now that Moore’s Law is slowing, and how packaging is changing as the traditional physical boundaries of electronics begin breaking down. https://youtu.be/UpH1m8Oru90 » read more

Tech Talk: Connected Intelligence


Gary Patton, CTO at GlobalFoundries, talks about computing at the edge, the slowdown in scaling, and why new materials and packaging approaches will be essential in the future. https://youtu.be/Zbz0R_yFFrQ » read more

Tech Talk: MCU Memory Options


David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package. https://youtu.be/6KoQTFbFVCo » read more

Tech Talk: Smart Manufacturing


Tom Salmon, vice president of collaborative technology platforms at SEMI, examines the electronics supply chain and what the industry organization is doing to pull all of the pieces together. https://youtu.be/jWX9mayMaZo Related Stories Smart Manufacturing Gains Momentum Problems remain for legacy infrastructure, but adoption will continue to grow as gaps are identified and plugged. ... » read more

Tech Talk: 7nm Litho


David Fried, chief technology officer at Coventor, digs into future scaling issues involving multi-patterning and new transistor types. https://youtu.be/FBnYRAL1xKY Related Stories Inside Next-Gen Transistors Coventor’s CTO looks at new types of transistors, the expanding number of challenges at future process nodes & the state of semiconductor development in China. Faster Time T... » read more

Tech Talk: FD-SOI vs. FinFET


Jamie Schaeffer, 22FDX program director at GlobalFoundries, talks about the future of FD-SOI, what the tradeoffs are in performance, power and cost compared with finFETs, how many mask layers and patterning steps are required for each, and when 12nm FD-SOI will be introduced. Related Stories To 7nm And Beyond GlobalFoundries’ top technologists open up on next-gen FD-SOI, the economi... » read more

Tech Talk: Embedded Memories


Dave Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of new types of embedded memory, including which work best for certain applications and with various advanced packaging options. [youtube vid=7D9zoA9FFIw] » read more

Tech Talk: GPU-Accelerated Photomasks


Noriaki Nakayamada, group manager for the data control engineering group in NuFlare's Mask Lithography engineering Department, talks about what's changing on the mask side, where the trouble spots are, and how to deal with them at advanced process nodes. [youtube vid=f8PixJMadXw] » read more

Tech Talk: Double-Triple Patterning


Mentor Graphics' David Abercrombie shows the differences and challenges in double patterning versus triple patterning. [youtube vid= e0wZmjBbEf0] » read more

← Older posts