category: Videos

category: Auto, Security & Edge AI

Advanced Part Average Testing For Chips
By Ed Sperling - 26 Aug, 2025 - Comments: 0

Part average testing, one of the mainstays of semiconductor test, is becoming much more challenging at advanced nodes and in multi-die assemblies. In the past, PAT produced a Gaussian distribution that made it relatively simple to find outliers. That's no longer the case. Advanced packaging and leading-edge designs have unique attributes that determine which rules apply, such as the thickness o... » read more

Machine Learning In Semiconductor Manufacturing
By Ed Sperling - 22 Aug, 2025 - Comments: 0

Second in a seven-part series: Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but it remains relevant even today. It can be applied to semiconductor fab for such things as predictive maintenance of manufacturing equipment, rather than just maintenance on a schedule, which decreases downtime. But getting this right is har... » read more

AI, From A To Z
By Ed Sperling - 15 Aug, 2025 - Comments: 0

First in a seven-part series: What's the difference between AI, ML, DL, LLMs, and agentic AI? Is it truly revolutionary, or is it an evolutionary series of steps that have enabled machines to do much more than in the past? Jon Herlocker, vice president and general manager of software analytics at Cohu, talks about the evolution of AI over nearly 70 years, the chain of innovation that has enable... » read more

AI In The IC Equipment Ecosystem
By Ed Sperling - 21 Jul, 2025 - Comments: 0

AI is playing an increasingly critical role in improving semiconductor equipment and processes, which are necessary as the industry moves to advanced manufacturing processes. This requires more steps, tighter integration and analysis of those various steps, and better optimization of tools. David Fried, corporate vice president at Lam Research, talks about how to accelerate the development of A... » read more

Big Changes In Medical Electronics
By Ed Sperling - 09 Jun, 2025 - Comments: 0

Medical devices are becoming more capable, more complicated, and more deployable in the field rather than in a hospital or a doctor's office. But getting these purpose-built devices into the hands of consumers requires a whole bunch of new challenges, from safeguarding fragile on-board chemistries that can be destroyed by existing chip manufacturing and packaging processes to ensuring the mater... » read more

Emerging Technologies Driving Heterogeneous Integration
By Ed Sperling - 24 Sep, 2024 - Comments: 0

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to new architectures, new materials such as glass substrates, and a variety of new challenges. Dick Otte, president and CEO of Promex I... » read more

Secure Movement Of Data In Test
By Ed Sperling - 16 Apr, 2024 - Comments: 0

Historically, test data flowed out of the tester and was loaded into a file. But with heterogeneous integration, including chiplets and IP from multiple vendors, test data is now being streamed across the manufacturing floor where it can be used to make real-time decisions. Eli Roth, product manager for smart manufacturing at Teradyne, talks with Semiconductor Engineering about challenges in da... » read more

Challenges Of Testing Advanced Packages
By Ed Sperling - 19 Sep, 2023 - Comments: 0

The number of things that can wrong in assembly and test increases as more chips are added into a package. Testing is the usual guarantor of a reliable device, but in an advanced package there are all sorts of new issues — more contacts, different handling requirements, the necessary thermal conditions for test, and variation within the package. George Harris, vice president of global test se... » read more

High-NA EUV Progress And Problems
By Gregory Haley - 22 Aug, 2023 - Comments: 0

High-NA EUV will enable logic scaling for at least the next couple process nodes. It’s complex, expensive, and a feat of optical engineering, but there are a lot of components with mixed progress. Harry Levinson, principal lithographer at HJL Lithography, talks  about when this technology will likely show up, what problems still need to be resolved, and what comes next. Related Readin... » read more

Challenges Of Heterogeneous Integration
By Ed Sperling - 13 Jul, 2023 - Comments: 0

Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology, talks about a variety of issues ranging from uneven aging, warpage, and different mechanical stresse... » read more

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