category: Videos

category: Auto, Security & Edge AI

Challenges In Packaging 5G And 6G
By Ed Sperling - 16 May, 2023 - Comments: 0

Millimeter wave frequencies are essential for transferring more data more quickly, but they also require different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around antenna in package, antenna on package, flexible circuits, and different substrates. Curtis Zwenger, vice president of R&D at Amkor Technology, talks about a host of new challenges rangi... » read more

How Curvilinear Mask Writing Affects Chip Design
By Ed Sperling - 12 Apr, 2023 - Comments: 0

As chips become more complex and features continue to shrink, it becomes more difficult to print shapes on photomasks. The ability to print curvilinear masks changes that equation, but not all of the pieces in the flow are automated today. Aki Fujimura, CEO of D2S, talks about what has to change, what will the impact be on design rules, and why using curvilinear shapes can shrink the manufactur... » read more

Heterogeneous Integration Issues And Developments
By Ed Sperling - 14 Dec, 2022 - Comments: 0

There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks about how this will change chip design and manufacturing, and how those changes are likely to unfol... » read more

Increased Photomask Density And Its Impact On EDA
By Ed Sperling - 13 Dec, 2022 - Comments: 0

The ability to print curvilinear shapes on photomasks can have big repercussions on semiconductor design. Aki Fujimura, CEO of D2S, explains why mask rule checking has been bound by complex design rules, and why curvilinear shapes are important for reducing margin and simplifying the chip design process. » read more

Why Changes In Computing Are Driving Changes In Photomasks
By Ed Sperling - 18 Oct, 2022 - Comments: 0

Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about massive improvements in computation based upon increased density on chips, and why printing Manhattan shapes on a photomask are no longer sufficient to print high-performance devices with predictable reliability every time. He explains why a discontinuity in EDA physical design has opened the door for printing curvilinear shap... » read more

Deep Learning In Industrial Inspection
By Ed Sperling - 24 May, 2022 - Comments: 0

Deep learning is at the upper end of AI complexity, sifting through more data to achieve more accurate results. Charlie Zhu, vice president of R&D at CyberOptics, talks about how DL can be utilized with inspection to identify defects in chips that are not discernible by traditional computer vision algorithms, classifying multiple objects simultaneously from multiple angles and taking into accou... » read more

Using GPUs In Semiconductor Manufacturing
By Ed Sperling - 25 Apr, 2022 - Comments: 0

Massive simulation and curvilinear shapes are forcing the photomask industry to rethink what types of chips work best. Aki Fujimura, CEO of D2S, talks about what happens when shapes printed on a mask are closer to what actually gets printed, how GPUs can be used to accelerate CPUs in single instruction/multiple data (SIMD) operations, and why pixel data is different from other data. » read more

Next-Gen Transistors
By Ed Sperling - 07 Mar, 2022 - Comments: 0

Nanosheets, or more generally, gate-all-around FETs, mark the next big shift in transistor structures at the most advanced nodes. David Fried, vice president of computational products at Lam Research, talks with Semiconductor Engineering about the advantages of using these new transistor types, along with myriad challenges at future nodes, particularly in the area of metrology. » read more

Design Technology Co-Optimization
By Ed Sperling - 18 Jan, 2022 - Comments: 0

Rising complexity is making it increasingly difficult to optimize chips for yield and reliability. David Fried, vice president of computational products at Lam Research, examines the benefits of automated rules to manage the relationship between layout and design requirements on one side, and process flows and rules/checks on the other. Benefits include reduced margin, shortened time to market,... » read more

Open Cavity Plastic Packaging
By Ed Sperling - 30 Sep, 2021 - Comments: 0

Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets a... » read more

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