The Week In Review: Manufacturing

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

May The Cheapest Memory Win

There are a number of new memory types on the horizon. So why are we still using DRAM, SRAM and hard disk drives developed decades ago? The answer is complicated. Memory, whether it’s on-chip static RAM cache or off-chip dynamic RAM—or flash storage or spinning magnetic media—is really a stack of data storage technologies that need to work seamlessly together and with other non-memory ... » read more

Stacked Die Changes

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at Samsung; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. What follows are excerpts of tha... » read more

E-beam Vs. Optical Inspection

The wafer inspection business is heating up as chipmakers encounter new and tiny killer defects in advanced devices. Last month ASML Holding entered into an agreement to acquire Hermes Microvision (HMI), the world’s largest e-beam inspection vendor, for $3.1 billion. The proposed move propelled ASML into the e-beam wafer inspection market. In addition, [getentity id="22817" e_name="Appl... » read more

Atomic Layer Etch Heats Up

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

Plotting The Next Semiconductor Road Map

The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more

Fab Investment Increases In China

By Mark LaPedus & Ed Sperling Fab construction in China is heating up, driven by real and projected demand for IoT devices and the government's push for internally manufactured chips. [getentity id="22819" comment="GlobalFoundries"], UMC and [getentity id="22586" comment="TSMC"] are all actively building up fab capacity inside of China, usually in conjunction with other local governme... » read more

How To Make 3D NAND

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

What’s Next For NAND?

NAND flash memory is a key enabler in today’s systems, but it’s a difficult business. NAND suppliers require deep pockets and strong technology to survive in the competitive landscape. And going forward, vendors face new challenges on several fronts. On one front, for example, the overall NAND market is currently in the doldrums, amid soft product prices and a mild capacity glut. Demand ... » read more

One-On-One: Dave Hemker

Dave Hemker, CTO at [getentity id="22820" comment="Lam Research"], sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will reshape the semiconductor industry in the future. What follows are excerpts of that conversation. SE: One of the big discussion topics these days is [getkc id="208" commen... » read more

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