tag: bonding

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation
By Gabriel Chang - 16 Nov, 2023 - Comments: 0

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) of solder joints is a widely adapted and stable process in the industry. The applications of MR include flip chip, ball mounting, surface mount technology (SMT), ... » read more

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate
By SeokHo Na - 21 Sep, 2023 - Comments: 0

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and experiencing rapid growth. As most of these applications require high performance, single-die Flip Chip packages... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process
By Brewer Science - 14 Aug, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

A Technical Guide To Selecting A Photosensitive Permanent Bonding Material
By Jessica Albright - 15 Jun, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

Next Gen Laser Assisted Bonding (LAB) Technology
By SeokHo Na - 18 May, 2023 - Comments: 0

In the semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting rapid growth. Among them, CPU data processing, AI and data cloud require much higher power consumption than smart phones or tablets. For the higher power applications, Flip Chip ball grid array (FCBGA) or 2.... » read more

Surface-Activated ALD For Room-Temperature Bonding of Al2O3
By Technical Paper Link - 03 Apr, 2023 - Comments: 0

A new technical paper titled "Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition" was published by researchers at Kyushu University. Abstract "In this study, room-temperature wafer bonding of Al2O3 thin films on Si thermal oxide wafers, which were deposited using atomic layer deposition (ALD), was realized using the surface-activated bonding (SAB) metho... » read more

Managing Thermal-Induced Stress In Chips
By Karen Heyman - 16 Feb, 2023 - Comments: 0

At advanced nodes and in the most advanced packages, physics is no one's friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase mechanical stress. On the flip side, thinner dielectrics and tighter spaces make it more difficult to insulate and protect against that heat, and in conjunction with those smaller features and higher d... » read more

Unknowns And Challenges In Advanced Packaging
By Ed Sperling - 19 Jan, 2023 - Comments: 0

Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that conversation. SE: Companies have been designing heterogeneous chips to take advantage of specific applications or use cases, but th... » read more

New Method to Measure, At The Wafer Scale, Direct Bonding Energies (CEA-LETI)
By Technical Paper Link - 12 Dec, 2022 - Comments: 0

A new technical paper titled "Double cantilever beam bonding energy measurement using confocal IR microscopy" was published by researchers at Univ. Grenoble Alpes, CEA-LETI and SOITEC, Parc Technologique des Fontaines. "A new technique is assessed in order to measure, at the wafer scale, direct bonding energies. It is derived from the standard Double Cantilever Beam (DCB) method and uses int... » read more

Hot Trends In Semiconductor Thermal Management
By Karen Heyman - 17 Nov, 2022 - Comments: 1

Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold. Far worse, however, is the loss of power and reliability, as overheated DRAM has to continually r... » read more

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