Fill/Cut Self-Aligned Double-Patterning


By David Abercrombie, Rehab Ali, Ahmed Hamed-Fatehy, and Shetha Nolke Self-aligned double patterning (SADP) is an alternative double-patterning process to the traditional litho-etch-litho-etch (LELE) approach used in most advanced production nodes. The main difference between the two approaches is that in LELE, the layout is divided between two masks, and the second mask is aligned with resp... » read more

450mm And Other Emergency Measures


Talk about boosting wafer sizes from 300mm to 450mm has been creeping back into presentations and discussions at conferences over the past couple months. Earlier this year, discussions focused on panel-level packaging. These are basically similar approaches to the same problem, which is that wafers need to be larger to reap efficiencies out of device scaling. Whether either of these approach... » read more

The Pitfalls Of Auto-Stitching In Double-Patterning


Ever since the first double-pattern (DP) odd-cycle error ring was produced on a layout, designers have longed for a magic solution to solve it. Traditionally, the first approach to fixing an odd-cycle error was to move a polygon or a polygon edge to increase spacing to an adjoining polygon in the cycle. Alternatively, you could remove a polygon altogether, or split it into two pieces. All of th... » read more

Time To Pay The Piper


The Pied Piper of Hamelin is a German fable about a rat catcher who used his magic pipe to lure away rats. When he was not paid by the town, he used his pipe to lure away all of the town's children. I am not suggesting that exactly the same is true for the semiconductor industry and having not paid [getkc id="7" kc_name="EDA"], but I do not think they have paid enough and they will now have to ... » read more

Colorless vs. Colored Double-Patterning Design Flows


Colored vs. Colorless double patterning design flows—do you know which one is best for your design? What options does your foundry allow? Do you debug one differently from the other? In this short video, I’ll demonstrate the differences between colored and colorless DP design flows, and explain the options and potential pitfalls of each approach. With a better understanding of how to design... » read more

Bulk CMOS Vs. FD-SOI


The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

ECOs and Multi-Patterning: It Can Be Done


By David Abercrombie and Alex Pearson A lot has been written and discussed about how to decompose (color) layouts for advanced process nodes that require multi­patterning (MP). However, one topic that has been sorely ignored is how to efficiently make changes to designs that are already colored, or even taped out and processed. We tend to act like all designs work out the first time through... » read more

When And How Should I Color My DP layout?


Designers working with advanced process technologies that require double patterning often find themselves puzzling over the best way to setup or optimize their design flows to ensure their layouts can be decomposed without time-wasting mistakes. Because manual coloring can be challenging even for experienced engineers, many prefer to use automated coloring solutions. But when is the best time a... » read more

Predictions For 2016: Semiconductors, Manufacturing And Design


Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Tech Talk: Double-Triple Patterning


Mentor Graphics' David Abercrombie shows the differences and challenges in double patterning versus triple patterning. [youtube vid= e0wZmjBbEf0] » read more

← Older posts