The Week In Review: Manufacturing

What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

Conquering Heat Issues In e-beam Lithography

By Noriaki Nakayamada What's the best way to deal with the menacing heating effects in VSB mask writing? The answer lies in part on leveraging GPU acceleration. Check out this video on what's ahead for multi-beam mask writing. [youtube vid=Ij2l3hk6aFg] —Noriaki Nakayamada is group manager at NuFlare Technology. » read more

Beam Me Up

By Mark LaPedus For years, electron-beam tools have been struggling to keep up with photomask complexity, causing an alarming increase in write times and mask production costs. Intel and others recently warned that e-beams soon could reach their fundamental limits, thereby requiring the need for new solutions. And in the multiple patterning era, mask makers could see their capital costs soa... » read more