2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

Test Challenges Rising For Mobile Devices


Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

Improved Efficiency


By Bhanu Kapoor We constantly hear about process technology advances and their impact on power consumption of ICs, but the power management techniques have remained the same over last few process technology generations. Power gating, dynamic voltage and frequency scaling, and threshold voltage scaling have been the key power management techniques since the 90nm process technology. Clock gating... » read more