Going Vertical?


The topic of transistor scaling has been traditionally covered at SEMICON West in its own right. This year’s event, however, will also explore scaling in 3D, as well as using packaging to accomplish similar objectives. Along with traditional transistor scaling, speakers will tackle design and metrology considerations for scaling the package, and address the economic decisions that inform dens... » read more

Inside Next-Gen Transistors


David Fried, chief technology officer at [getentity id="22210" e_name="Coventor"], sat down with Semiconductor Engineering to discuss the IC industry, China, scaling, transistors and process technology. What follows are excerpts of that conversation. SE: In a recent roundtable discussion you talked about some of the big challenges facing the IC industry. One of your big concerns involves th... » read more

Changing Direction In Chip Design


Andrzej Strojwas, chief technologist at PDF Solutions and professor of electrical and computer engineering at Carnegie Mellon University—and the winner of this year's Phil Kaufman Award for distinguished contributions to EDA—sat down with Semiconductor Engineering to talk about device scaling, why the semiconductor industry will begin to fragment around new architectures and packaging, and ... » read more

Moore’s Law Debate Continues


Does shrinking devices still make sense from a cost and performance perspective? The answer isn’t so simple anymore. Still, the discussion as to whether semiconductors are still on track with [getkc id="74" comment="Moore's Law"] occurs on a frequent enough basis to continue analyzing at least some of the dynamics at play. There is much speculation about what happens after 7nm, as well as ... » read more

Deeper Inside Intel


Mark Bohr, senior fellow and director of process architecture and integration at Intel, and Zane Ball, vice president in the Technology and Manufacturing Group at Intel and co-general manager of Intel Custom Foundry, sat down with Semiconductor Engineering to discuss the future directions of transistors, process technology, the foundry business and packaging. What follows are excerpts of those ... » read more

How To Scale IoT For “Time To Money,” Security


When it comes to design, IoT can be boiled down to “time to money.” It’s more complex than that, of course, but the unique, dynamic nature of the segment is changing the way we design systems and how we think about security. “IoT is not a device. It’s delivering service across the cloud to connected devices,” said Nandan Nayampally, vice president of marketing with ARM. “In the... » read more

RC Delay: Bottleneck To Scaling


R = resistance — the difficulty an electrical current has in passing through a conducting material. C = capacitance — the degree to which an insulating material holds a charge. RC delay = the delay in signal speed through the circuit wiring as a result of these two effects. RC delay is important because it can become a significant obstacle to continued downward scaling of logic and... » read more

No More Straight Lines


Shrinking features on a chip is no longer the only way forward, and in an increasing number of designs and markets, it is no longer the best way forward. Power and performance are generally better dealt with using different architectures and microarchitectures, and all of those provide the potential to reduce silicon area (cost). Cramming more transistors on a die and working around leakage... » read more

The Economics Of Moore’s Law


By Marc Heyns I’m very optimistic about the continuation of Moore’s Law. But in saying that, I’m speaking about Moore’s Law purely as an economic law. I believe we’ll be able to offer increasing amounts of functionality at lower and lower costs. And technological innovations as well as advances in design and application will be crucial in realizing this. But I don’t believe a ne... » read more

Executive Insight: Aart de Geus


SE: What worries you most? De Geus: Everything I do is with high intensity, and what is of super high intensity right now—and there are challenges and opportunities in it—is that we have the confluence of some very big changes right now happening at the same time. On the technology side, there are multiple intersections. One is the intersection of another 10 years of Moore’s Law—finF... » read more

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